石墨烯與奈米顆粒複合熱介面材料 應用於高功率IGBT元件熱管理

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凃勝勛(Sheng-Xun Tu) 查詢紙本館藏

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機械工程學系

論文名稱

石墨烯與奈米顆粒複合熱介面材料應用於高功率IGBT元件熱管理
(Graphite nanoplatelet-based and nanoparticle composites as thermal interface materials and application to the thermal management of high power IGBT devices)

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摘要(中)

本論文探討雙向IGBT Converter系統與自主式微電網連結，其熱管理是非常重要的，因為高電壓或高電流將間接地或連續地產生高溫使其使用壽命減短，甚至破壞整體系統運作，特別是使用高功率元件絕緣柵雙極晶體管(insulated gate bipolar transistor, IGBT)。熱界面材料(Thermal interface materials, TIM) 對於高功率元件散熱有很大的改善與幫助，在本論文中所使用TIM是將兩種高散熱的TIM納米石墨片(graphite nanoplatelets, GNPs)與納米顆粒（nanoparticles, NPs）進行疊加試驗，疊加方式是通過網印製程以確保NPs均勻的印在GNPs上，利用疊加的TIM使得熱界面材料的有效熱傳遞以及良好的散熱性能應用在Converter系統中IGBT實驗中並加以探討。
本論文以Converter系統中IGBT為對象利用一個以模擬技術(finite difference or finite element method)的方法，並透過模擬軟體COMSOL進行模擬，且實際進行實驗對高功率元件之結構進行熱管理分析，包含熱源、起始與邊界條件、各種散熱情境對元件溫度分布與最終性能之影響。並將以IGBT模塊的內部結構和材料特性為基礎，探討熱循環與熱應力使導致焊料層疲勞、鋁接線斷裂或剝離、(Direct bonded copper ,DBC)直接覆銅基板失效等故障產生。

摘要(英)

In this study, the thermal management of the Converter system is of great importance since very high voltage/current will be switched intermittently and/or continuously and high temperature is detrimental to the service life of electronics, especially for the switching devices such as insulated gate bipolar transistor (IGBT). Thermal interface materials (TIMs) are generally composed of highly conductive particle fillers such as high thermal conductivity of graphite and a matrix such that efficient heat transfer and good compliance of the interface material can be achieved during application. In this paper, two types of TIMs are tested based on the hybridization of graphite nanoplatelets (GNPs) and the nanoparticles (NPs). The hybrid materials are fabricated via screen printing process to ensure the conformal uniformity of NPs spreading on the GNPs.
In particular, existing Institute of nuclear energy research Converter is the key component and core components is the high-power IGBT. We carry out mechanical simulations using a finite element method (FEM) simulator (COMSOL) for a simplified 3D power assembly to calculate the different temperatures fields due to natural and forced convection conditions. In addition to collecting the relevant literature relevant to IGBT failure modes and Direct bonded copper (DBC) failure.

關鍵字(中)

★ 電力轉換器
★ IGBT
★ 熱界面材料
★ 疲勞破壞

關鍵字(英)

★ Converter
★ IGBT
★ Thermal interface material
★ Fatigue damage

論文目次

摘要 i
Abstract ii
致謝 v
目錄 v
圖目錄 vii
表目錄 xiii
第一章緒論 1
1-1　前言 1
1-2　研究動機與目的 2
1-3　論文架構 3
第二章文獻回顧 4
2-1　高功率元件 4
2-2　熱介面材料 6
2-3　模擬方法 7
第三章複合熱介面材料之熱阻與熱導率分析 10
3-1　導論 10
3-2　實驗架構 11　
3-3 結果與討論 18
第四章 IGBT量測模擬比較與破壞分析 26
4-1　IGBT量測與模擬比較 26
4-1-1　IGBT量測實驗 27
4-1-2 IGBT模擬實驗 35
4-1-3　IGBT量測與模擬結果比較 46
4-2　IGBT破壞分析 48
第五章結論與建議 57
5-1　結論 57
5-3　未來展望 60
參考文獻 61

參考文獻

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指導教授

傅尹坤(Yiin-Kuen Fuh)

審核日期

2015-7-9

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