姓名 |
彭哲瑄(Che-Hsuan Peng)
查詢紙本館藏 |
畢業系所 |
光電科學與工程學系 |
論文名稱 |
以光學軟性電路板設計適用於4通道 × 25-Gbps 光學連接收發模組之高頻傳輸線 (Design of Transmission Lines for 4-Channel × 25-Gbps Optical Interconnect Module Based on Optical Flexible Printed Circuit)
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相關論文 | |
檔案 |
[Endnote RIS 格式]
[Bibtex 格式]
[相關文章] [文章引用] [完整記錄] [館藏目錄] 至系統瀏覽論文 (2027-7-1以後開放)
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摘要(中) |
本論文將4通道 25-Gbps高頻傳輸線整合於軟性電路板中,此設計作為連接接收端光偵測器、轉阻放大器(TIA)與發射端垂直共振腔型面射型雷射(VCSEL)、積體驅動晶片(Driver IC)之間的高頻訊號傳輸。而再將上述元件與高分子聚合物波導與45˚反射面共同整合在軟性電路板上。
此論文評估與分析用於軟性電路板上之高頻傳輸線,包含單端訊號傳輸線(Single-Ended)與差動訊號傳輸線(Differential)的反射損耗(Return loss)與插入損耗(Insertion Loss)。
傳輸線係以共平面波導(Coplanar Waveguide)形式設計。經由高頻模擬,在操作頻率0~62.5 GHz中,發射端與接收端之單端式高頻傳輸線反射損耗均小於 -4 dB,插入損耗皆大於-2.8 dB。而另一方面在操作頻率0~62.5 GHz,中,差動式高頻傳輸線反射損耗皆小於 -6 dB,插入損耗皆大於 -1.7 dB。 |
摘要(英) |
In this paper, the 4-channel 25-Gbps high-frequency transmission line is integrated into the flexible circuit board. This design is used as a high frequency transmission line between a receiver-side photodetector, a transimpedance amplifier (TIA) and a transmitter-side Vertical Cavity Surface Emitting Laser (VCSEL), and an integrated driver chip.And then the above elements and polymer waveguide and 45˚ reflective surface common integration in the flexible circuit board.
This paper evaluates and analyzes high frequency transmission lines for use on flexible circuit boards, including the single-ended transmission line and differential transmission line of the return loss and insertion loss.
The transmission lines are designed in the form of a coplanar waveguide. Through the high frequency simulation, the operating frequency of 0 ~ 62.5GHz The single-ended transmission line return loss of the transmitter and the receiver is less than -4 dB, the insertion loss is above -2.8 dB. On the other hand, in the operating frequency of 0 ~ 62.5 GHz, the differential transmission line return loss is less than -6 dB, insertion loss are more than -1.7 dB. |
關鍵字(中) |
★ 光學軟性電路板 ★ 4通道 × 25-Gbps ★ 光學連接收發模組 |
關鍵字(英) |
★ Optical Interconnect Module ★ 4-Channel × 25-Gbps ★ Optical Flexible Printed Circuit |
論文目次 |
摘要 i
Abstract ii
目錄 iii
圖目錄 iv
表目錄 vi
第一章 緒論 1
1-1 前言 1
1-2 光學連接技術的發展歷程與現況 3
1-3 以光學軟性電路板設計光學連接收發模組之高頻傳輸線 8
第二章 光學連接收發模組之高頻被動電路設計 11
2-1 被動電路設計原理 12
2-2 被動電路設計架構與流程 14
第三章 光學連接收發模組之發射端電路設計 16
3-1 收發模組之發射端單端式傳輸線電路設計 17
3-2 收發模組之發射端差動式傳輸線電路設計 20
第四章 光學連接收發模組之接收端電路設計 24
4-1 收發模組之接收端單端式傳輸線電路設計 25
4-2 收發模組之接收端差動式傳輸線電路設計 28
第五章 結論與未來展望 31
5-1 結論 31
5-2 未來展望 31
參考文獻 33 |
參考文獻 |
[1] Cisco Visual Networking Index: Global Mobile Data Traffic Forecast Update, 2016–2021.
[2] Cisco The Zettabyte Era: Trends and Analysis.
[3] Cisco Global Cloud Index: Forecast and Methodology, 2015–2020.
[4] Novel Trace Design for High Data-rate Multi-channel Optical Transceiver Assembled using Flip-chip Bonding.
[5] A 25-Gb/s × 4-Ch, 8 × 8 mm2, 2.8-mm Thick Compact Optical Transceiver Module for On-Board Optical Interconnect.
[6] Polymer waveguides for electro-optical integration in data centers and high-performance computers.
[7] Feature Articles: Device Technology Development for Beyond 100G Optical Transport Network.
[8] 以光學軟性電路板設計適用於4通道 × 25-Gbps 光學連接收發模組之光學架構。 |
指導教授 |
伍茂仁(Mount-Learn Wu)
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審核日期 |
2017-8-23 |
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