姓名 |
鐘同安(Tong-An Zhong)
查詢紙本館藏 |
畢業系所 |
光電科學與工程學系 |
論文名稱 |
以玻璃基板中介層整合二維陣列高分子聚合物波導設計4 x 4通道 x 25-Gbps光連接發射模組 (4 x 4-Channel x 25-Gbps Optical Interconnect Transmitter Based on Glass Interposer Combined with Two-Dimensional Polymer Waveguides)
|
相關論文 | |
檔案 |
[Endnote RIS 格式]
[Bibtex 格式]
[相關文章] [文章引用] [完整記錄] [館藏目錄] 至系統瀏覽論文 (2027-7-1以後開放)
|
摘要(中) |
在本論文中,提出在玻璃基板中介層整合二維陣列高分子聚合物波導設計4 x 4通道 x 25-Gbps光連接發射模組,以玻璃基板為中介層,將4 x 4面射型雷射,以覆晶封裝在玻璃基板上完成,並將被動電路,透鏡整合至玻璃基板上,並整合高分子聚合物的波導,完成此模組的設計。
發射端光學模擬在各個不同的通道上的耦合效率,耦合效率在45%到49%之間,並進行光學串音的分析,在-30dB以下皆可忽略。
高頻傳輸線的設計,目前只有設計單端傳輸線設計,包含兩部分設計,第一部分設計為玻璃基板上面傳輸線的設計,在62.5-GHz,其反射損耗為-17dB,插入損耗為-0.2dB。第二部分設計為經過從玻璃基板上方的接合墊,經過銅柱,到玻璃基板底側的傳輸線,最佳的設計為在直徑40 μm,在62.5-GHz其反射損耗為-17dB,其插入損耗為-0.25dB。 |
摘要(英) |
In this thesis, 4 x 4-Channel x 25-Gbps Optical Interconnect Transmitter Based on Glass Interposer Combined with Two-Dimensional Polymer Waveguides is proposed. 4 x 4 VCSEL was flip-chip mounted to the glass. The microlens and polymer waveguide will be integrated on glass interposer.
The coupling efficiency on each of the different channels of the transmitter are between 45% and 49%.The analysis of optical crosstalk are below -30dB, so they can be ignored.
The high-frequency transmission line is currently single-ended transmission line design, including two parts design. The first part is designed for the transmi-
ssion line on the top side of the glass substrate. At 62.5-GHz, the return loss is -17dB and the insertion loss is -0.2dB. The second part is designed to pass fr-
om the bonding pad on the glass substrate, through the copper column, to the bottom of the glass substrate transmission line. The best design for the diameter of copper column is 40 μm. In this situation, the return loss is -17dB, the insertion loss of -0.25dB. |
關鍵字(中) |
★ 光連接 ★ 波導 ★ 二維陣列 |
關鍵字(英) |
|
論文目次 |
摘要 i
Abstract ii
目錄 iii
圖目錄 v
表目錄 vii
第一章 緒論 1
1-1 前言 1
1-2 光連接技術發展現況 3
1-3以玻璃基板中介層整合二維陣列高分子聚合物波導設計4 4通道 25-GBPS光連接發射模組 6
第二章 發射端光學模組設計 8
2-1 以玻璃中介層為架構之發射端光學結構 8
2-2 面射型雷射之規格 11
2-3 高分子聚合物波導與微透鏡之設計 12
2-4 發射端面射型雷射波導與光纖位移容忍度模擬分析 18
2-5 發射端光學系統之光學串音分析 21
2-6 發射端傳輸線之設計 22
2-6-1 高頻傳輸線損耗之分析方法 22
2-6-2 發射端單端傳輸線的設計 23
第三章 結論與未來展望 27
3-1 結論 27
3-2 未來展望 28
參考文獻 29 |
參考文獻 |
[1]CISCO Global Cloud Index: Forecast and Methodology(2015-2020), 2016.
[2]Scaling Limits for Copper Interconnects (2011)
[3]D. A. B. Miller, “Physical reasons for optical interconnection,” Int. J. Optoelectron. 11, 155–168 (1997).
[4]Doany, Fuad E., et al. ”160 Gb/s bidirectional polymer-waveguide board-level optical interconnects using CMOS-based transceivers.” IEEE Transactions on Advanced Packaging 32.2 (2009): 345-359.
[5]Brusberg, Lars, et al. ”Glass carrier based packaging approach demonstrated on a parallel optoelectronic transceiver module for PCB assembling.” Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th. IEEE, 2010.
[6]Shiraishi, Takashi, et al. ”Cost-effective optical transceiver subassembly with lens-integrated high-k, low-Tg glass for optical interconnection.” Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st. IEEE, 2011.. |
指導教授 |
伍茂仁(Mount-Learn Wu)
|
審核日期 |
2017-8-23 |
推文 |
facebook plurk twitter funp google live udn HD myshare reddit netvibes friend youpush delicious baidu
|
網路書籤 |
Google bookmarks del.icio.us hemidemi myshare
|