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姓名 林威沅(Wei-Yuan Lin) 查詢紙本館藏 畢業系所 電機工程學系 論文名稱 隨機合成晶圓圖之B-score隨機性驗證與應用於特殊晶圓圖
(Verification of B-score Randomness by Synthetic Random Wafer Maps and Application to Special Patterns)相關論文 檔案 [Endnote RIS 格式] [Bibtex 格式] [相關文章] [文章引用] [完整記錄] [館藏目錄] 至系統瀏覽論文 ( 永不開放) 摘要(中) 本篇論文為藉由實驗室先前研究晶圓圖特性分界,針對其分界所產生出的新參數:B-score,並利用原先有的參數NBD(瑕疵晶粒總數)、NCL(瑕疵晶粒連續線總數)進行隨機性的分析,而一般晶圓圖是由隨機性和系統性錯誤所組成,我們將分界進行更嚴謹的分析,強化分界之準確性,並增加測試效率。
首先,我們先使用隨機數產生的合成晶圓,將原本1.96倍的標準差(95%信賴區間)增加至2.58倍(99%信賴區間)及3.89倍(99.99%信賴區間),在全域的分析之下,加強B-Score隨機性之驗證。其後再以正規化NBD做各區段的常態性分析,觀察同一區段所產生的B-Score之分布在我們所找的幾個臨界點上是否符合,驗證B-score為一個標準分數。
最後,利用自製的合成特殊晶圓圖,除了原本分類的錯誤型態,也加入了便於我們觀察較於特殊的晶圓圖,觀察其與B-score之關係,並了解B-score的特性。也將我們利用B-score所找出來結果較為不準確的實際晶圓圖,利用減少一些較分散的瑕疵晶粒或瑕疵晶粒群,得知相較於人工判別這些皆會影響我們隨機性分析之結果。
摘要(英) In this thesis, a boundary of wafer map characteristics is used by previous research to generate a new parameter: B-score. We use this parameter to verify randomness by the original parameters: NBD (Number of Bad Die) and NCL (Number of Contiguous Line). The general wafer map is composed of random and systematic errors. We will strictly verify the boundary to enhance its accuracy and increase test efficiency.
First, we generate synthetic wafers by random number. Increasing the original standard deviation of 1.96 times (95% confidence interval) to 2.58 times (99% confidence interval) and 3.89 times (99.99% confidence interval), we use full-range analysis to enhance the verification of randomness. And then verify the normality of normalized NCL. Observed whether distribution of B-score meets to our critical points. By these steps, verified B-score is a standard score.
At last, we derive synthetic special patterns to the original classification of failure types. we are also added some special wafer maps which facilitated our observation. To observe the relation with B-score, and know more about its behaviors. We also use B-score to judge some inaccurate real wafer. By removing some single dies or clusters, we can know more about these single dies or clusters will affect the result of randomness test.
關鍵字(中) ★ 晶圓圖
★ 隨機性錯誤
★ 系統性錯誤
★ 標準差
★ 信賴區間
★ 常態分析關鍵字(英) ★ Wafer map
★ Random errors
★ Systematic errors
★ Standard deviation
★ Confidence interval
★ Normality analysis論文目次 中文摘要 I
ABSTRACT II
致謝 III
目錄 IV
圖目錄 VI
表目錄 VIII
第一章 簡介 1
1-1 前言 1
1-2 研究動機 1
1-3 研究方法 2
1-4 論文架構 3
第二章 預備知識 4
2-1 相關研究 4
2-2迴力棒特徵圖 6
2-2-1特徵參數 NBD、NCL 6
2-2-2特徵參數搜尋方式 7
2-2-3特徵參數搜尋範例 8
2-3迴力棒特徵圖共生效應 10
2-4實際晶圓(WM-811K) 11
2-5 特徵參數: B-score 12
第三章 特徵參數及隨機性驗證 13
3-1 特徵參數B-score檢測 13
3-2 特徵參數標準化驗證 15
3-2-1 各晶圓大小對良率全域瑕疵數之分析 16
3-2-2 各晶圓大小對部分BD之分析 19
3-3 合成晶圓瑕疵晶粒數與B-score關係檢測 23
第四章 實驗結果及特殊晶圓圖實測 25
4-1 特殊晶圓圖模擬 25
4-1-1 特殊晶圓圖分類 25
4-1-2 自製特殊晶圓圖實測 26
4-2 B-Score對真實晶圓瑕疵晶粒之分析 34
第五章 結論 37
參考文獻 38參考文獻 [1] J.E. Chen, M.J. Wang, Y.S. Chang, S.C. Shyu, and Y.Y. Chen, “Yield Improvement by Test Error Cancellation ”, Proceedings of the Fifth Asian Test Symposium (ATS’96), pp.258-262, Nov. 1996.
[2] C.K. Hsu, F. Lin, K.T. Cheng, W. Zhang, X. Li, J.M. Carulli, and K.M. Butler, “Test data analytics - Exploring spatial and test-item correlations in production test data”, in International Test Conference (ITC), pp.1-10, Sep. 2013.
[3] M.J. Wu, J.S.R. Jang, and J.L. Chen, “Wafer Map Failure Pattern Recognition and Similarity Ranking for Large-scale Datasets”, in IEEE Transactions on Semiconductor Manufacturing, vol.28, no.1, pp.1-12, Feb. 2015.
[4] F. Lin, Hsu, C. - K., and Cheng, K. - T. Tim, “Learning from Production Test Data: Correlation Exploration and Feature Engineering”, in Test Symposium (ATS), pp.236-241, Nov. 2014.
[5] F. Lin, C.K. Hsu, and K.T. Cheng, “Feature engineering with canonical analysis for effective statistical tests screening test escapes”, in International Test Conference (ITC), pp.1-10, Oct. 2014.
[6] T. Nakazawa and D. V. Kulkarni, "Wafer Map Defect Pattern Classification and Image Retrieval Using Convolutional Neural Network," in IEEE Transactions on Semiconductor Manufacturing, vol. 31, no. 2, pp. 309-314, May 2018.
[7] 林正田,“Wafer Map Analysis from a Random-Defect-Source Perspective”,碩士論文﹐中央大學﹐2012.
[8] 曾國銓, “A Non-uniformly Distributed Defect Map Analysis by Quantification Model” , 碩士論文﹐中華大學﹐2013
[9] 蕭寶威,“Wafer Map Analysis from Random Distributed Defects”, 碩士論文﹐中央大學﹐2016.
[10] 葉昱緯,“Application of Boomerang Chart to Real-World Mass Production Wafer Maps”, 碩士論文﹐中央大學﹐2016.
[11] 吳雅軒,“Wafer Map Partition Analysis to Enhance Systematic Error Resolution”, 碩士論文﹐中央大學﹐2018.
[12] 林敬儒,“Identification of the Classifier for the Pattern of Spatial Randomness”, 碩士論文﹐中央大學﹐2018.
指導教授 陳竹一 審核日期 2019-4-25 推文 facebook plurk twitter funp google live udn HD myshare reddit netvibes friend youpush delicious baidu 網路書籤 Google bookmarks del.icio.us hemidemi myshare