參考文獻 |
1.B. Rainer, K. Hahn, and J. Stienecker, “Technology description methods for
LIGA processes ”, Journal of Micromechanics and Microengineering, 5, 2, 1995, pp. 196.
2.A. Michael, J. Arnold, W. Ehrfeld, “Laser LIGA: a cost-saving process for
flexible production of microstructures ” ,Micromachining and Microfabrication Process Technology, 2639, pp. 164-174, Austin, America, 1995.
3.S. Ishizaka, “Laser LIGA-excimer laser micro-structuring and replication”, Lambda Phys. Highlights, 45, 1994, pp. 1-3.
4.P. Rai-Choudhury, Handbook of microlithography, micromachining, and
microfabrication: microlithography., Society of Photo Optical., Washington, 1997.
5.R. Dermanaki, K. Chizari, D. Therriault, “Three-dimensional printing of
freeform helical microstructures: a review ”, Nanoscale, 6, 18, 2014, pp. 10470-10485.
6.X. Li, C. Wang, W. Zhang, Y. Li, “Fabrication and characterization of
porous Ti6Al4V parts for biomedical applications using electron beam melting process ”, Materials Letters, 63, 3-4, 2009, pp. 403-405.
7.L.S. Bertola, W.K. Júniora, C. Aumund-Kopp, “Medical design: direct
metal laser sintering of Ti–6Al–4V ”, Materials & Design, 31, 8, 2010, pp. 3982-3988.
8.郭哲男,蘇郁倫,「電子束3D列印技術」,科學發展,523,2016,16-
19頁。
9.J.D. Madden, I.W . Hunter, “Three-dimensional microfabrication by
localized electrochemical deposition ”, Journal of microelectromechanical systems, 5, 1, 1996, pp. 24-32.
10.G. Zangari, “Electrodeposition of alloys and compounds in the era of A. Brenner, Electrodeposition of alloys: principles and practice., Elsevier, 1963
11.A. Brenner, Electrodeposition of alloys: principles and practice., Elsevier,
1963.
12.F.C. Walsh, C.T.J. Low, “A review of developments in the electrodeposition of tin-copper alloys ”, Surface and Coatings Technology, 304, 2016, pp. 246-262.
13.D. Padhi, S. Gandikota, Hoa B. Nguyen, C. Guirk, S. Ramanathan, “ Electrodeposition of copper–tin alloy thin films for microelectronic applications ”, Electrochimica acta, 48, 8, 2003, pp. 935-943.
14.A.N. Correia, M.X. Façanha, P. de Lima-Neto, “Cu–Sn coatings obtained from pyrophosphate-based electrolytes ”, Surface and Coatings Technology, 201, 16-17, 2007, pp. 7216-7221.
15.A.E. Rehim, S.M. Sayyah, M.M. El Deeb, “Tin-copper alloy electrodeposition from acidic gluconate baths ”, Transactions of the IMF, 78, 2, 2000, pp. 74-78.
16.C. Han, Q. Liu, D.G. Ivey, “Development of simple electrolytes for the electrodeposition and electrophoretic deposition of Pb-free, Sn-based alloy solder films ”, CS MANTECH Conference, Austin, Texas, USA, 2007.
17.G. Heidari, S.M. Mousavi Khoie, M.E. Abrishami, M. Javanbakht, “Electrodeposition of Cu–Sn alloys: theoretical and experimental approaches ”, Journal of Materials Science: Materials in Electronics, 26, 3, 2015, pp. 1969-1976.
18.R. Juškėnas, Z. Mockus, S. Kanapeckaitė, G. Stalnionis, A. Survila, “XRD studies of the phase composition of the electrodeposited copper-rich Cu–Sn alloys ”, Electrochimica Acta, 52, 3, 2006, pp. 928-935.
19.E.M. El-Giar, D.J. Thomson, “Localized electrochemical plating of interconnectors for microelectronics ”, IEEE WESCANEX 97: Communications, Power and Computing. Conference Proceedings, pp. 327-
332, Winnipeg, Manitoba, 1997.
20.游絢博,「陽極單軸間歇運動下之直流、脈衝微電析鎳」,國立中央大學,碩士論文,2000。
21.S.K. Seol, J.M. Yi, X. Jin, C.C. Kim, J.H. Je, “Coherent microradiology directly observes a critical cathode-anode distance effect in localized electrochemical deposition ”, electrochemical and solid-state letters, 7, 9,
2004, pp. C95-C97.
22.S.K. Seol, A.R. Pyun, Y. Hwu, G. Margaritondo, J.‐H. Je, “Localized Electrochemical Deposition of Copper Monitored Using Real‐Time X‐ray Microradiography ”, Advanced Functional Materials, 15, 6, 2005, pp. 934-937.
23.S.K. Seol, J.T. Kim, J.H. Je, Y. Hwu, “Fabrication of freestanding metallic micro hollow tubes by template-free localized electrochemical deposition ”,
Electrochemical and solid-state letters, 10, 5, 2007, pp. C44-C46.
24.C.S. Lin, C.Y. Lee, J.H. Yang, “Improved copper microcolumn fabricated by localized electrochemical deposition ”, Electrochemical and Solid-State Letters, 8, 9, 2005, pp. C125-C129.
25.C.Y. Lee, C.S. Lin, B.R. Lin, “Localized electrochemical deposition process improvement by using different anodes and deposition directions ”, Journal of Micromechanics and Microengineering, 18, 10, 2008, pp.105-008.
26.S. Gan, M. Rahman, “Fabrication of complex shape electrodes by localized electrochemical deposition ”, Journal of Materials Processing Technology, 209, 9, 2009, pp. 4453-4458.
27.F. Wang, H. He, “Parametric electrochemical deposition of controllable morphology of copper micro-columns ”, Journal of The Electrochemical Society, 163, 10, 2016, pp. E322-E327.
28.F. Wang, H. Xiao, H. He, “Effects of applied potential and the initial gap between electrodes on localized electrochemical deposition of micrometer copper columns ”, Scientific reports, 6, 2016, pp. 260-270.
29.B. Abishek, Kamaraj, H. Shrestha, E. Speck, M. Sundaram, “Experimental study on the porosity of electrochemical nickel deposits ”, Procedia Manufacturing, 10, 2017, pp. 478-485.
30.F. Wang, J. Sun, D. Liu, “Effect of Voltage and Gap on Micro-Nickel-Column Growth Patterns in Localized Electrochemical Deposition ”, Journal of The Electrochemical Society, 164, 6, 2017, pp. D297-D301.
31.F. Wang, H. Bian, F. Wang, “Fabrication of Micro Copper Walls by Localized Electrochemical Deposition through the Layer by Layer Movement of a Micro Anode ”, Journal of The Electrochemical Society, 164, 12, 2017, pp. D758-D763.
32.J.C. Lin, S.B. Jang, D.L. Lee, “Fabrication of micrometer Ni columns by continuous and intermittent microanode guided electroplating ”, Journal of Micromechanics and Microengineering, 15, 12, 2005, pp. 2405.
33.T.K. Chang, J.C. Lin, J.H. Yang, “Surface and transverse morphology of micrometer nickel columns fabricated by localized electrochemical deposition ”, Journal of Micromechanics and Microengineering, 17, 11, 2007, pp. 2336.
34.J.H. Yang, J.C. Lin, T.K. Chang, G.Y. Lai, “Assessing the degree of localization in localized electrochemical deposition of copper ”, Journal of Micromechanics and Microengineering, 18, 5, 2008, pp. 055023.
35.J.C. Lin, T.K. Chang, J.H. Yang, D.L. Lee, “Fabrication of a micrometer Ni–Cu alloy column coupled with a Cu micro-column for thermal measurement ”, Journal of Micromechanics and Microengineering, 19, 1, 2008, pp. 015030.
36.J.H. Yang, J.C. Lin, T.K. Chang, “Localized Ni deposition improved by saccharin sodium in the intermittent MAGE process ”, Journal of Micromechanics and Microengineering, 19, 2, 2009, pp. 025015.
37.J.C. Lin, T.K. Chang, J.H. Yang, “On the structure of micrometer copper features fabricated by intermittent micro-anode guided electroplating ”, Electrochimica Acta, 54, 24, 2009, pp. 5703-5708.
38.T.C. Chen, Y.R. Hwang, J.C. Lin, “The Development of a Real-Time Image Guided Micro Electroplating System ”, Int. J. Electrochem. Sci, 5, 2010, pp. 1810-1820.
39.Y.J. Ciou, Y.R. Hwang, J.C. Lin, “Fabrication of two-dimensional microstructures by using micro-anode-guided electroplating with real-time image processing ”, ECS Journal of Solid State Science and Technology, 3, 7, 2014, pp. P268-P271.
40.顧乃華,「以微陽極導引電鍍法製備銅螺旋微米結構與其機械性質分析」,國立中央大學,碩士論文,2005。
41.張瑞慶,「奈米壓痕技術與應用」,聖約翰科技大學。
42.楊仁泓,局部電化學沈積法之一維結構製程及機械性質量測」,大葉大學,碩士論文,2004。
43.K.R. Mamaghani, S.M. Naghib, “The Effect of Stirring Rate on Electrodeposition of Nanocrystalline Nickel Coatings and their Corrosion Behaviors and Mechanical Characteristics ”, Int. J. Electrochem. Sci, 12, 2017, pp. 5023-5035.
44.H. Natter, R. Hempelmann, “Nanocrystalline Copper by Electrodeposition: The Effects of Organic Additives, Bath Temperature, and pH ”, The Journal of Physical Chemistry, 100, 50, 1996, p. 19525-19532.
45.A. Varea, E. Pellicer, S. Pané, “Mechanical properties and corrosion behaviour of nanostructured Cu-rich CuNi electrodeposited films ”, Int. J. Electrochem. Sci, 7, 2012, pp. 1288-1302.
46.L.C. Tsao, C.W. Chen, “Corrosion characterization of Cu–Sn intermetallics in 3.5 wt.% NaCl solution ”, Corrosion Science, 63, 2012, pp. 393-398.
47.W. Xu, X. Lu, B. Zhang, “Effects of Porosity on Mechanical Properties and Corrosion Resistances of PM-Fabricated Porous Ti-10Mo Alloy ”, Metals, 8, 3, 2018, pp. 188.
48.O.M.S. Quintero, W.A. Chaparro, L. Ipaz, “Influence of the microstructure on the electrochemical properties of Al-Cr-N coatings deposited by co-sputtering method from a Cr-Al binary target ”, Materials Research, 16, 1, 2013, pp. 204-214.
49.S. Charlie, “A new understanding of the heat treatment of Nb-Sn superconducting wires ”, The Florida State University, PhD Thesis, 2017.
50.劉謹綸,「以微電鍍法製備三維銅錫介金屬化合物微結構」,國立中央大學,碩士論文,2018。 |