數位影像相關法應用於殘留應力量測

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姓名

江茂誠(Mao-Cheng Jiang) 查詢紙本館藏

畢業系所

光機電工程研究所

論文名稱

數位影像相關法應用於殘留應力量測
(Digital image correlation method applied to residual stress measurement)

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摘要(中)

本研究開發了一套非接觸式的殘留應力量測系統，利用熱處理會釋放殘留應力的特性，配合數位影像相關法(Digital Image Correlation, DIC)能量測表面位移的功能，計算出表面因殘留應力釋放造成的應變。配合彈性力學的數學模型分析，達成表面殘留應力的量測。本研究同時評估了待測物熱處理後的晶體結構改變、厚度變化與熱翹曲對量測值的影響，並進行量測補償，有效提升量測之精準度。
為了驗證實驗的正確性，本研究採用光彈法與X-Ray殘留應力量測儀來進行驗證，實驗之量測結果與驗證工具之量測結果皆相互吻合。在確認了系統的正確性之後，本研究使用量測不確定度原理來評估量測精度，其精度約為(E/(1-v))‧10-4。相較一般傳統的殘留應力檢測技術僅能進行單點量測，本研究能達成二維平面的殘留應力檢測。使人們可以更快速地找出殘留應力所集中的位置，對工業的製造與設計擁有極大的幫助。除此之外，此技術還具備低成本、架設簡單與非接觸式量測之優勢，應用於量測設備的量產或商用機台之整合都有十分良好的前景。

摘要(英)

In this study, a non-contact residual stress measurement system was developed. Utilizing the characteristics of heat treatment to release residual stress, combined with the function of digital image correlation that can measure surface displacement, the strain of the surface due to the release of residual stress is calculated. Cooperate with the mathematical model analysis of elasticity to achieve the measurement of residual stress on the surface. This study also evaluated the effects of metallographic changes, thickness changes and thermal warpage on the measured value after the heat treatment of the test object, and performed measurement compensation to effectively improve the accuracy of the measurement.
In order to verify the correctness of the experiment, this experiment uses the photoelastic method and X-Ray residual stress measuring instrument to verify the residual stress measurement results, and the estimated measurement resolution is about (E/(1-v))‧10-4. Compared with the traditional residual stress detection technology, only single point measurement can be carried out. This study can achieve two-dimensional large-area residual stress detection, which can more quickly find the location of residual stress concentration. It has the advantages of industrial manufacturing and design. In addition, this technology has the advantages of low cost, easy installation and non-contact measurement. It is very promising for mass production of measurement equipment or integration of commercial machines.

關鍵字(中)

★ 殘留應力量測
★ 數位影像相關法

關鍵字(英)

★ Digital Image Correlation
★ Residual stress

論文目次

摘要 I
Abstract II
致謝 III
圖目錄 VII
表目錄 IX
第一章緒論 1
1-1 研究背景 1
1-2 文獻回顧 2
1-2-1 數位影像關係法 2
1-2-2 影像校正技術 5
1-2-3殘留應力量測 6
1-2-4 光彈法 8
1-2-5 積層製造之材料分析 10
1-3 研究動機與目的 11
1-4 論文架構 13
第二章實驗原理 14
2-1 數位影像相關法應用於殘留應力量測 14
2-1-1 數位影像相關法量測 14
2-1-2 廣義虎克定律 20
2-2影像的校正與補償 21
2-2-1相機位置移動 22
2-2-2試片熱處理後厚度變化與量測面傾斜 22
2-2-3晶體結構改變對DIC量測的影響 24
2-2-4校正與補償流程 25
2-3 光彈法 26
2-3-1 光彈法量測殘留應力 26
2-3-2 光彈法解相 28
2-4 小結 31
第三章系統架構 32
3-1 數位影像相關法 32
3-1-1實驗設備 32
3-1-2實驗流程 34
3-2 光彈驗證 40
3-2-1實驗設備 40
3-2-2 實驗流程 41
3-3 小結 44
第四章實驗結果與討論 45
4-1 量測樣本與規格 45
4-2量測殘留應力校正 46
4-2-1 厚度變化造成的誤差 46
4-2-2 量測面傾斜造成的誤差 49
4-2-3 晶體結構改變造成的誤差 49
4-2-4 小結 50
4-3 量測結果 51
4-4 光彈法驗證 54
4-4-1 光彈法與數位影像相關法之應力量測 55
4-4-2光彈法與數位影像相關法之殘留應力量測 58
4-5 系統性能分析 61
4-5-1 量測精度 61
4-5-2 系統量測範圍 64
4-6 小結 65
第五章誤差分析 66
5-1 系統誤差 66
5-2 隨機誤差 67
5-2-1 元件之熱膨脹 67
5-2-2 長時間的環境擾動 68
5-2-3 電子雜訊 69
5-3 小結 69
第六章結論與未來展望 70
6-1 結論 70
6-2 未來展望 70
參考文獻 71
附錄透視變換對數位影像相關法之量測校正 74

參考文獻

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指導教授

李朱育(Ju-Yi Lee)

審核日期

2020-8-20

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