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姓名	王虹(Hung Wang)  查詢紙本館藏	畢業系所	化學工程與材料工程學系
論文名稱	銅基板殘留應力對銅接點性質影響之研究 (Effect of Residual Stress in Cu Substrate on Joint Properties for Cu-to-Cu Bonding)
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檔案	[Endnote RIS 格式]    [Bibtex 格式]    [相關文章]   [文章引用]   [完整記錄]   [館藏目錄]   至系統瀏覽論文 (2029-7-31以後開放)
摘要(中)	近年來由於科技發展迅速，對於功率元件的需求上升，然而目前可應用於高溫的電子構裝材料卻相當有限。奈米銅膠因具有優良的熱導及電導性、高抗電遷移與電化學遷移、不會與接合之銅線產生介金屬化合物等特性，成為一種具備前瞻性的構裝材料，因而如何提升接點之可靠度便成為重要議題。奈米粒子具有高表面能，容易相互團聚並燒結，而與之接合的基板則為塊材，性質較穩定，但是多項因素如燒結之氣氛、粒子幾何形貌與基板微結構均將影響接點強度。若能提升粒子與基板的燒結程度，將對接點可靠度的發展帶來重要貢獻。 本研究旨在探討銅基板中的殘留應力對於接點強度的影響，並從原子擴散動力學之角度提供未來學理研究之基礎。藉由對基板進行不同時間的退火處理，可有效調整殘留應力。經推力測試與數值分析後，發現應力高低與接點強度有關。當退火時間愈長，殘留應力下降，接點強度亦隨之下降。此外，本研究更提出了詳細的機制，解釋殘留應力於燒結過程中如何影響原子擴散的行為。藉由深入討論材料的擴散機制，本研究具有重要意義，可進一步推動電子構裝領域的發展。
摘要(英)	In recent years, due to the rapid development of technology, the demand for power devices has increased significantly. However, the materials currently available for high-temperature electronic packaging are quite limited. Among them, Cu nanoparticle (NP) paste has emerged as a promising packaging material owing to its excellent thermal and electrical conductivity, high electromigration and electrochemical migration, and its ability to prevent the formation of intermetallic compounds (IMCs) with the bonded copper wires. Therefore, enhancing the reliability of Cu sintering joints has become a crucial issue. Literature indicates that various factors such as the sintering atmosphere, particle geometry, and the microstructure of the substrate can all influence the joint strength. NPs have high surface energy, making them tend to aggregation and sintering, while the substrates they bond with are bulk materials with more stable properties. Improving the level of sintering between particles and the substrate would significantly contribute to the development of joint reliability. This study aims to investigate the influence of residual stress in Cu substrates on joint strength and to provide a fundamental understanding from the perspective of atomic diffusion dynamics for future theoretical research. By annealing the substrate for different durations, the residual stress can be effectively adjusted. Through shear tests and numerical analysis, a correlation between the level of stress and joint strength is found. The results show that longer annealing time reduce residual stress, which in turn lowers the joint strength. Additionally, this study proposes a detailed mechanism for explaining how residual stress affects atomic diffusion behavior during the sintering process. Through an in-depth discussion of material, the findings of this research are significant and further advance the field of electronic packaging.
關鍵字(中)	★ 銅銅接合 ★ 奈米顆粒 ★ 殘留應力	關鍵字(英)	★ Cu-Cu bonding ★ Nanoparticle ★ Residual stress
論文目次	摘要 i ABSTRACT ii 致謝 iii TABLE OF CONTENTS v LIST OF FIGURES vii LIST OF TABLES ix CHAPTER 1 INTRODUCTION 1 1-1 Background 1 1-2 Packaging techniques 4 1-2-1 Pb-free solders 5 1-2-2 TLP bonding 10 1-2-3 Cu-to-Cu bonding 12 1-2-4 Ag nanoparticle sintering 17 1-2-5 Cu nanoparticle sintering 20 1-3 Processing factors influencing nanoparticle paste sintering 23 1-3-1 Microstructures of nanoparticles 23 1-3-2 Atmosphere 28 1-3-3 Microstructures of substrates 32 CHAPTER 2 MOTIVATION 37 CHAPTER 3 EXPERIMENTAL PROCEDURE 38 3-1 Preparation of Cu NP paste 38 3-2 Pre-treatment of Cu substrate and bonding process 38 3-3 Analysis and characterization of Cu NPs 39 3-4 Measurement of residual stress in Cu substrates 39 3-5 Shear strength and fracture surface analysis of joints 41 CHAPTER 4 RESULTS AND DISCUSSION 42 4-1 Characterization of Cu NP and Cu substrate 42 4-2 Mechanical strength of Cu paste joints 48 4-3 Residual stress analysis 54 4-4 Calculations of chemical potential and driving force 56 CHAPTER 5 CONCLUSION 64 REFERENCE 65
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指導教授	吳子嘉(Albert T. Wu)	審核日期	2024-8-20
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