參考文獻 |
[1] S. K. Aarief, “Diffusion Soldering for the High-temperature Packaging of Power Electronics,” FAU Studien aus dem Maschinenbau, 2018.
[2] S. J. Pearton, J. Yang, P. H. Cary, F. Ren, J. Kim, M. J. Tadjer, and M. A. Mastro, “A review of Ga2O3 materials, processing, and devices,” Appl. Phys. Rev., vol. 5, no. 1, Jan. 2018.
[3] R. Brown, “A novel AlGaN/GaN based enhancement-mode high electron mobility transistor with sub-critical barrier thickness,” Phd thesis, University of Glasgow, Jul. 2015.
[4] D. Balaz, “Current Collapse and Device Degradation in AlGaN/GaN Heterostructure Field Effect Transistors,” Phd thesis, University of Glasgow, 2011.
[5] O. Ambacher, J. Smart, J. R. Shealy, N. G. Weimann, K. Chu, M. Murphy, W. J. Schaff, L. F. Eastman, R. Dimitrov, L. Wittmer, M. Stutzmann, W. Rieger, and J. Hilsenbeck, “Two-dimensional electron gases induced by spontaneous and piezoelectric polarization charges in N- and Ga-face AlGaN/GaN heterostructures,” J. Appl. Phys., vol. 85, no. 6, pp.3222-3233, Mar. 1999.
[6] S. Sharbati, I. Gharibshahian, T. Ebel, A. A. Orouji, W. T. Franke, “Analytical Model for Two‑Dimensional Electron Gas Charge Density in Recessed‑Gate GaN High‑Electron‑Mobility Transistors,” Journal of Electronic Materials, 50, pp.3923–3929, Apr. 2021.
[7] O. Hilt, A. Knauer, F. Brunner, E. Bahat-Treidel, and J. Würfl, “Normally-off AlGaN/GaN HFET with p-type GaN gate and AlGaN buffer,” 2010 22nd International Symposium on Power Semiconductor Devices & IC′s (ISPSD), pp.347-350, June. 2010.
[8] X. Sun, Y. Zhang, K. S. Chang-Liao, T. Palacios, T. P. Ma, “Impacts of fluorine-treatment on E-mode AlGaN/GaN MOS-HEMTs,” 2014 IEEE International Electron Devices Meeting, pp. 17.3.1-17.3.4, Dec. 2014.
[9] X. Huang, Z. Liu, Q. Li, F. Lee, “Evaluation and application of 600V GaN HEMT in cascode structure,” 2013 Twenty-Eighth Annual IEEE Applied Power Electronics Conference and Exposition (APEC), pp.1279-1286, Mar. 2013.
[10] J. Wu, W. Lu, P. K. L. Yu, “Normally-OFF AlGaN/GaN MOS-HEMT with a two-step gate recess,” 2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC), pp.594-596, Oct. 2015.
[11] Y. Wang, J. Wei, S. Yang, J. Lei, M. Hua, K. J. Chen, “Investigation of Dynamic IOFF Under Switching Operation in Schottky-Type p-GaN Gate HEMTs,” IEEE Transactions on Electron Devices, vol. 66, no. 9, pp. 3789–3794, Sept. 2019.
[12] Z. Jiang, M. Hua, X. Huang, L. Li, C. Wang, J. Chen, K. J. Chen, “Negative Gate Bias Induced Dynamic On-resistance Degradation in Schottky-type p-GaN Gate HEMTs,” IEEE Transactions on Power Electronics, Nov. 2021.
[13] F. Zhou, W. Xu, F. Ren, Y. Xia, L. Wu, T. Zhu, D. Chen, R. Zhang, Y. Zheng, H. Lu, “1.2 kV/25 A Normally off P-N Junction/AlGaN/GaN HEMTs With Nanosecond Switching Characteristics and Robust Overvoltage Capability,” IEEE Transactions on Power Electronics, vol. 37, no. 1, pp. 26–30, Jan. 2022.
[14] C. Zhang, S. Liu, S. Li, Y. Ma, W. Lu, J. Huang, W. Sun, Z. Yang, Y. Zhu, L. Ni, “Investigation on the Degradation Mechanism for GaN Cascode Device Under Repetitive Hard-Switching Stress,” IEEE Transactions on Power Electronics, vol. 37, no. 5, pp. 6009-6017, May. 2022.
[15] J. P. Kozak, Q. Song, J. Liu, R. Zhang, Q. Li, W. Saito, Y. Zhang, “Accelerating the Recovery of p-Gate GaN HEMTs after Overvoltage Stresses,” 2022 IEEE International Reliability Physics Symposium (IRPS), pp. P22-1-P22-5, Mar. 2022.
[16] G. Zu, H. Wen, Y. Zhu, R. Zhong, Q. Bu, W. Liu, Y. Zhao, M. Cui, “Review of Pulse Test Setup for the Switching Characterization of GaN Power Devices,” IEEE Transactions on Electron Devices, vol. 69, no. 6, pp. 3003-3013, June. 2022.
[17] Y. Zhang and C. Qu, “Table-Based Direct Power Control for Three-Phase AC/DC Converters Under Unbalanced Grid Voltages,” IEEE Transactions on Power Electronics, vol. 30, no. 12, pp. 7090-7099, Dec. 2015.
[18] J. Schweickhardt, K. Hermanns and M. Herdin, “Tips & Tricks on Double Pulse Testing,” Rohde & Schwarz Application Note, Mar. 2021.
[19] “GS66508B Datasheet,” GaN System Inc., 2018.
[20] “TO-247, GS66508B GaN board Setup Guide,” Keysight Technologies, 2021.
[21] “FFSH5065A-F155 Datasheet,” ON Semiconductor Inc., 2020.
[22] “GN008 Application Note,” GaN Systems Inc., Mar. 08, 2022.
[23] J. Joh and J. A. del Alamo, “A Current-Transient Methodology for Trap Analysis for GaN High Electron Mobility Transistors,” IEEE Transactions on Electron Devices, vol. 58, no. 1, pp. 132-140, Jan. 2011.
[24] J. Hu, S. Stoffels, S. Lenci, B. Bakeroot, R. Venegas, G. Groeseneken, and S. Decoutere, “Current transient spectroscopy for trapping analysis on Au-free AlGaN/GaN Schottky barrier diode,” Appl. Phys. Lett., vol. 106, issue 8, Feb. 2015.
[25] A. Y. Polyakov, I. H. Lee, “Deep traps in GaN-based structures as affecting the performance of GaN devices,” Materials Science and Engineering: R: Reports, vol. 94, pp. 1-56, Aug. 2015.
[26] R. Zhang, J. P. Kozak, M. Xiao, J. Liu and Y. Zhang, "Surge-Energy and Overvoltage Ruggedness of P-Gate GaN HEMTs," IEEE Transactions on Power Electronics, vol. 35, no. 12, pp. 13409-13419, Dec. 2020.
[27] Atlas User’s Manual, Silvaco Inc., Aug. 2016.
[28] R. J. Trew, D. S. Green and J. B. Shealy, "AlGaN/GaN HFET reliability," IEEE Microwave Magazine, vol. 10, no. 4, pp. 116-127, June. 2009. |