SMT-ELS機聯網實體材料交握通訊軟體設計與驗證

以作者查詢圖書館館藏

、以作者查詢臺灣博碩士

、以作者查詢全國書目

、勘誤回報

、線上人數：68

、訪客IP：18.222.110.70

姓名

羅子靖(Tzu-Ching Luo) 查詢紙本館藏

畢業系所

資訊工程學系在職專班

論文名稱

SMT-ELS機聯網實體材料交握通訊軟體設計與驗證
(Implementation of Material Handoff Handshake Software for SEMI SMT-ELS)

相關論文

★ 整合GRAFCET虛擬機器的智慧型控制器開發平台	★ 分散式工業電子看板網路系統設計與實作
★ 設計與實作一個基於雙攝影機視覺系統的雙點觸控螢幕	★ 智慧型機器人的嵌入式計算平台
★ 一個即時移動物偵測與追蹤的嵌入式系統	★ 一個固態硬碟的多處理器架構與分散式控制演算法
★ 基於立體視覺手勢辨識的人機互動系統	★ 整合仿生智慧行為控制的機器人系統晶片設計
★ 嵌入式無線影像感測網路的設計與實作	★ 以雙核心處理器為基礎之車牌辨識系統
★ 基於立體視覺的連續三維手勢辨識	★ 微型、超低功耗無線感測網路控制器設計與硬體實作
★ 串流影像之即時人臉偵測、追蹤與辨識─嵌入式系統設計	★ 一個快速立體視覺系統的嵌入式硬體設計
★ 即時連續影像接合系統設計與實作	★ 基於雙核心平台的嵌入式步態辨識系統

檔案

[Endnote RIS 格式]

[Bibtex 格式]

[相關文章]

[文章引用]

[完整記錄]

[館藏目錄]

至系統瀏覽論文 (2028-7-31以後開放)

摘要(中)

台灣的印刷電路板產業推出了SMT製程技術來應付目前市場所需要的高度精細的小體積電子產品需求，但是目前要使用SMT製程技術仍需花費許多人力及時間在操作設備及資料傳輸上面，為此SEMI國際半導體產業協會提出了SMT-ELS A1/A1.1通訊協議，希望可以透過SMT自動解決上述問題。
本研究的目標是實作出SMT-ELS A1/A1.1通訊協議的實體材料交握通訊，但是在實體材料交握通訊過程中，訊號及狀態組合種類繁多，難以快速的建立出正確的系統架構，為此本研究採用MIAT方法論來設計系統架構，基於SMT-ELS A1/A1.1通訊協議內容所制定的流程及狀態，去建立系統的IDEF0功能模組，接著在對每個功能模組依照通訊規範進行離散事件建模，建立Grafcet模型，最後再做軟體高階合成。軟體驗證的部份則是會依據通訊協議的正常交握流程及異常處理流程，確認各項訊號變化及狀態轉移是否符合規範。

摘要(英)

The printed circuit board industry in Taiwan has introduced Surface Mount Technology (SMT) process to meet the growing demand for highly precise and compact electronic products in the current market. However, using SMT process still requires a significant amount of manpower and time for equipment operation and data transmission. To address this issue, SEMI International, the semiconductor industry association, has proposed the SMT-ELS A1/A1.1 communication protocol, aiming to automate the aforementioned challenges through SMT.
The objective of this study is to implement the Material Handoff Handshake of the SMT-ELS A1/A1.1 communication protocol. However, in the process of Material Handoff Handshake, there are numerous signal and state combinations, making it challenging to quickly establish the correct system architecture. Therefore, this study adopts the MIAT methodology to design the system architecture. Based on the processes and states specified in the SMT-ELS A1/A1.1 communication protocol, the IDEF0 functional modules of the system are developed. Subsequently, each functional module is discretely event modeled according to the communication specifications, establishing a Grafcet model. Finally, software high-level synthesis is performed. In terms of software validation, it involves confirming whether the signal variations and state transitions comply with the protocol, based on the normal handshaking process and abnormal handling process of the communication protocol.

關鍵字(中)

★ SMT-ELS
★ 機聯網
★ 實體材料握手
★ MIAT方法論

關鍵字(英)

★ SMT-ELS
★ M2M
★ Material Handoff Handshake

論文目次

摘要 i
Abstract ii
誌謝 iii
目錄 iv
圖目錄 vi
表目錄 ix
第一章、緒論 1
1.1研究背景 1
1.2研究目的 3
1.3論文架構 3
第二章、技術回顧 4
2.1機聯網 4
2.2 Socket API 5
2.2.1 TCP/UDP 6
2.2.2 Socket通訊流程 9
2.3 SAMI SMT-ELS A1/A1.1協定內容 10
2.3.1預期控制方案 11
2.3.2產線設備配置 11
2.3.3通訊架構 15
2.4 MIAT系統設計方法論 20
2.4.1 IDEF0階層式架構 21
2.4.2 Grafcet離散事件建模 23
2.4.3 高階軟體合成 25
第三章、系統架構 28
3.1 Material Handshake介紹 28
3.1.1 Mode Resolution Handshake 29
3.1.2 Material Handoff Handshake 30
3.2 SMT-ELS整體架構 32
3.3 Material Handoff Handshake系統架構 36
3.4 Material Handoff Handshake離散事件建模 37
3.4.1 Pause And Abort功能模組 37
3.4.2 Handoff Main功能模組 41
第四章、軟體驗證 45
4.1實驗開發環境 45
4.2 MHH相關設定 45
4.3 MHH正常流程測試 47
4.4 MHH異常處理流程測試 51
4.4.1 MHH異常處理Resume & Retry & Forward流程 52
4.4.2 MHH異常處理Pause Take Over & Abort流程 56
第五章、結論與未來展望 59
5.1結論 59
5.2未來展望 60
參考文獻 61

參考文獻

[1] Y. Lu, X. Xu, and L. Wang, “Smart Manufacturing Process and System Automation – A Critical Review of the Standards and Envisioned Scenarios.” Journal of Manufacturing Systems, vol. 56 , pp. 312-325, 2020.
[2] Y. Cao, T. Jiang, and Z. Han. “A Survey of Emerging M2M Systems: Context, Task, and Objective.” IEEE Internet of Things Journal, vol. 3, no. 6, pp. 1246-1258, 2016.
[3] P.K. Verma , R. Verma, A. Prakash, A. Agrawal, K. Naik, R. Tripathi, M. Alsabaan, T. Khalifa, T. Abdelkader, and A. Abogharaf. “Machine-to-Machine (M2M) Communications: A Survey.” Journal of Network and Computer Applications, vol. 66, pp. 83-105, 2016.
[4] S. Vitturi, C. Zunino, and T. Sauter. “Industrial Communication Systems and Their Future Challenges: Next-Generation Ethernet, IIoT, and 5G.” Proceedings of the IEEE, vol. 107, no. 6,pp 944-961, 2019.
[5] K. E. Kolodziej, B. T. Perry, and J. S. Herd. “In-Band Full-Duplex Technology: Techniques and Systems Survey.” IEEE Transactions on Microwave Theory and Techniques, vol. 67, no. 7, pp. 3025-3041, 2019.
[6] T. C. Chan, “The Development of Smart Manufacturing and Cases Study in Taiwan.” in 2018 IEEE International Conference on Advanced Manufacturing (ICAM), pp. 117-118, 2018.
[7] Q. Qi, and F. Tao. “Digital Twin and Big Data Towards Smart Manufacturing and Industry 4.0: 360 Degree Comparison.” IEEE Access, vol. 6, pp. 3585-3393, 2018.
[8] S. Wang, J. Ouyang, D. Li, and C. Liu. “An Integrated Industrial Ethernet Solution for the Implementation of Smart Factory.” IEEE Access, vol. 5, pp. 25455-25462, 2017.
[9] T. Adame, A. Bel, B. Bellalta, J. Barcelo, and M. Oliver. “IEEE 802.11AH: The WiFi Approach for M2M Communications.” IEEE Wireless Communications, vol. 21, no. 6, pp. 144-152, 2014.
[10] R. L. R. Maata, R. Cordova, B. Sudramurthy, and A. Halibas. “Design and Implementation of Client-Server Based Application Using Socket Programming in a Distributed Computing Environment.” in 2017 IEEE International Conference on Computational Intelligence and Computing Research (ICCIC), 2017, pp. 1-4.
[11] J. Bohuslava, J. Martin, and H. Igor. “TCP/IP Protocol Utilisation in Process of Dynamic Control of Robotic Cell According Industry 4.0 Concept.” in 2017 IEEE 15th International Symposium on Applied Machine Intelligence and Informatics (SAMI), 2017, pp. 217-222.
[12] S. Radhakrishnan, Yuchung Cheng, Jerry Chu, Arvind Jain, and Barath Raghavan. “TCP Fast Open.” in Proceedings of the Seventh COnference on Emerging Networking EXperiments and Technologies, 2011, pp. 1-12.
[13] M. Masirap, M. H. Amaran, Y. M. Yussoff, R. A. Rahman, and H. Hashim. “Evaluation of Reliable UDP-Based Transport Protocols for Internet of Things (IoT).” in 2016 IEEE Symposium on Computer Applications & Industrial Electronics (ISCAIE), 2016, pp. 200-205.
[14] C. H. Chen , M. Y. Lin, and X. C. Guo. “High-Level Modeling and Synthesis of Smart Sensor Networks for Industrial Internet of Things.” Computers & Electrical Engineering, vol.61, pp. 48-66, 2017.
[15] J. A. B. Montevechi, F. Leal, A. F. de Pinho, R. F. Costa, M. L. M. de Oliveira, and A. L. F. Silva. “Conceptual Modeling in Simulation Projects by Mean Adapted IDEF: An Application in a Brazilian Tech Company.” in Proceedings of the 2010 Winter Simulation Conference, 2010, pp. 1624-1635.
[16] R. Julius, M. Schürenberg, F. Schumacher, and A. Fay. “Transformation of GRAFCET to PLC Code Including Hierarchical Structures.” Control Engineering Practice, vol. 64, pp. 173-194, 2017.

指導教授

陳慶瀚(Ching-Han Chen)

審核日期

2023-7-24

推文