以作者查詢圖書館館藏

、以作者查詢臺灣博碩士

、以作者查詢全國書目

、勘誤回報

、線上人數：141

、訪客IP：3.16.207.192

姓名	曾能翊(Neng-I Tseng)  查詢紙本館藏	畢業系所	通訊工程學系在職專班
論文名稱	SMT-ELS 機聯網垂直通訊應用情境設計與驗證 (Implementation of Vertical Communication Application Scenario Design and Verification for SEMI SMT-ELS)
檔案	[Endnote RIS 格式]    [Bibtex 格式]    [相關文章]   [文章引用]   [完整記錄]   [館藏目錄]   至系統瀏覽論文 (2028-7-31以後開放)
摘要(中)	由於工業4.0的推行，大多需以機台的自動化先執行，也就是從機聯網開始發展，因工業智慧智能化使得產業對於通訊整合的需求有所增加，因此本文提出SMT-ELS機聯網垂直通訊應用情境設計與驗證，針對垂直通訊連接整合，達到機聯網的效果，藉由TCP/IP通訊架構所設計，以MIAT方法論設計整個架構，透過功能模組化設計(IDEF0)來設計整體架構及規劃各個功能模組，再以離散事件系統建模(Grafcet)來說明各個功能模組流程，最後透過模組化設計流程，將機聯網實際應用情境透過主機及設備預先設置設備的Responder ID，簡稱RESPID，也就是回應者ID，因此能夠達成三種應用情境之驗證。
摘要(英)	Due to the implementation of Industry 4.0, most need to be implemented by the automation of the machine first, that is, from the beginning of the development of the machine network, due to industrial intelligence intelligence makes the industry increased demand for communication integration, so this paper proposes the SMT-ELS machine network vertical communication application scenario design and validation, focusing on the integration of the vertical communication links to achieve the effect of the machine network, designed by the TCP/IP communication architecture, with MIAT methodology to design the entire architecture, through the functional modularization design (IDEF0) to design the overall architecture and planning of each functional module, and then the discrete event system modeling (GEF0) to design and plan each functional module. The MIAT methodology is used to design the entire architecture, and the overall architecture and planning of each functional module is designed through functional modularization design (IDEF0), and then the discrete event system modeling (Grafcet) is used to illustrate the process of each functional module, and finally, through the modularization design process, the actual application of the machine network is pre-set through the host and the device Responder ID, or RESPID, which is the Responder ID, and the Respondent ID. Finally, through the modularization design process, the actual application scenarios of the machine network can be verified by pre-setting the Responder ID of the device by the host and the device, which is called RESPID, or Responder ID.
關鍵字(中)	★ 機聯網 ★ 垂直通訊 ★ 方法論	關鍵字(英)	★ SEMI SMT-ELS ★ Vertical Communication ★ MIAT
論文目次	摘要 I Abstract II 目錄 III 圖目錄 V 表目錄 VII 第一章、緒論 1 1.1 研究背景 1 1.2 研究目的 4 1.3 論文架構 4 第二章、技術回顧 5 2.1 機聯網及相關技術 5 2.2 Socket API技術 5 2.3 SEMI SMT-ELS A1/A1.1 7 2.4 MIAT方法論 9 2.4.1 IDEF0 功能模組化設計架構 10 2.4.2 GRAFCET 離散事件系統建模 12 2.4.3 軟體高階合成 14 第三章、垂直通訊一般數據模組系統架構 17 3.1 IDEF0整體模組架構設計 17 3.1.1 SEMI SMT-ELS A2功能模組 18 3.1.2 SEMI SMT-ELS A1功能模組 19 3.1.3 Socket System功能模組 20 3.1.4 Line CB Array功能模組 22 3.1.5 UpTiersystem Line功能模組 24 3.2垂直通訊一般數據離散事件系統建模 25 3.2.1 SEMI SMT-ELS A2(VC GD)離散事件系統建模 25 3.2.2 Socket System離散事件系統建模 28 3.2.3 Line CB Array離散事件系統建模 31 3.2.4 Up tier system Line離散事件系統建模 33 第四章、垂直通訊應用情境軟體驗證 34 4.1 開發軟體及虛擬機實作環境 34 4.2 垂直通訊GD派發與接收使用準則 35 4.2.1 設備端的角度接收與派發 36 4.2.2 主機端的角度接收與派發 36 4.2.3 上層主機端的角度接收與派發 37 4.3 垂直通訊GD應用情境驗證 37 4.3.1 配置檔 37 4.3.2應用情境模組及流程 38 4.3.3 垂直通訊廣播之應用情境(Broadcast) 43 4.3.4 垂直通訊指定設備之應用情境(Specified Nodes) 46 4.3.5 垂直通訊設備與設備間之應用情境(Adjacent Nodes) 47 第五章、結論及未來展望 49 5.1 結論 49 5.2 未來展望 50 參考文獻 51
參考文獻	[1]B. Chen, J. Wan, L. Shu, P. Li, M. Mukherjee and B. Yin, "Smart Factory of Industry 4.0: Key Technologies, Application Case, and Challenges," in IEEE Access, vol. 6, pp. 6505-6519, 2018. [2]T. C. Chan, "The Development of Smart Manufacturing and Cases Study in Taiwan," 2018 IEEE International Conference on Advanced Manufacturing (ICAM), pp. 117-118, 2018. [3]Alireza Esfahani; Georgios Mantas; Rainer Matischek; Firooz B. Saghezchi; Jonathan Rodriguez, Ani Bicaku, Silia Maksuti, Markus G. Tauber, Christoph Schmittner and Joaquim Bastos, "A Lightweight Authentication Mechanism for M2M Communications in Industrial IoT Environment," IEEE Internet of Things Journal, vol. 6, no. 1, pp. 288-296, 2019. [4]Y. K. Chen“Challenges and opportunities of internet of things” 17th Asia and South Pacific Design Automation Conference, 2012. [5]T. Merkle and R. Götzen, "Millimeter-wave surface mount technology for 3-D printed polymer multichip modules", IEEE Trans. Compon. Packag. Manuf. Technol., vol. 5, no. 2, pp. 201-206, Feb. 2015. [6]Jaehyun Choi et al., "Millimeter-Wave 5G Antenna-In-Package for Mobile Devices Featuring Intelligent Frequency Correction Using Distributed Surface Mount Technologies", 15th European Conference on Antennas and Propagation (EuCAP), pp. 1-5, Mar. 2021. [7]Yu-nan Han, Pei-yun Liang, "Surface Mounted Parallel Coupled Microstrip Bandpass Filter With Vertical Transition for 5G Millimeter Wave Applications", 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), pp.551-553, 2022 [8]J. Xingguo, Q. Yulin and Y. Jiancheng, "A Method to Streamline the TCP/IP Protocol Stack at Embedded Systems", Information 2010 International Conference of Science and Management Engineering (ISME), pp. 386-389, 2010. [9]Zhi Kanmai, "TCP/IP protocol security problems and defenses", 2020 International Conference on Intelligent Computing and Human-Computer Interaction (ICHCI), pp. 117-120, 2020. [10]C. H. Chen, M. Y. Lin, Xing-Chen Guo, "High Performance Fieldbus Application-Specific Integrated Circuit Design for Industrial Smart Sensor Networks," Journal of Supercomputing, September 2018, Vol.74, No.9, pp 4451-4469. [11]R. J. Mayer, “IDEF0 function modeling,” Air Force Systems Command, 1992. [12]R. David, "Grafcet: a powerful tool for specification of logic controllers," in IEEE Transactions on Control Systems Technology, vol. 3, no. 3, pp. 253-268, Sept. 1995
指導教授	陳慶翰 陳永芳(Ching-Han Chen Yung-Fang Chen)	審核日期	2023-7-24
推文	facebook   plurk   twitter   funp   google   live   udn   HD   myshare   reddit   netvibes   friend   youpush   delicious   baidu
網路書籤	Google bookmarks   del.icio.us   hemidemi   myshare