博碩士論文 111323103 詳細資訊




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姓名 戴慶瑜(Ching-Yu Tai)  查詢紙本館藏   畢業系所 機械工程學系
論文名稱 可控制2軸同步作動或單軸作動增強之磁力計設計與應用
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摘要(中) 本研究以磁力計結合加速度計的設計理念,設計可控制2軸同步作動或單軸作動增強之磁力計,此磁力計使用UMC 0.18 m CMOS製程,結構尺寸為995×932 μm^2,同時將電路製作於晶片內,完成單晶片(SoC)。該元件可以量測直流與交流磁場。
量測直流磁場時需給予交流的驅動電流,可分為同動模式與增強模式。同動模式可量測一平面的向量,適合應用於位置檢測的回授系統,使用驅動交流電流60 mA時,Y軸磁場的靈敏度為18.5 V/T,Z軸磁場的靈敏度為2.9 V/T。增強模式只需調整驅動電流頻率和相位,即可使Y軸磁場的靈敏度增加為37.5 V/T,大約2倍,能清楚量測到地磁,進行方位檢測的應用。
量測交流磁場時需給予直流的驅動電流1 mA,即可量測BLDC馬達的轉速及轉向,可用於馬達控制。
摘要(英) This design allows control of 2-axis simultaneous operation or single-axis enhanced operation of the magnetometer. This magnetometer uses UMC 0.18 μm CMOS process. The circuitry is integrated within the chip, resulting in a single-chip system-on-chip (SoC) solution. The MEMS structure has dimensions of 995 × 932 μm² and is capable of measuring both DC and AC magnetic fields.
When measuring DC magnetic fields, an AC driving current is required. In simultaneous mode, the device can measure the magnetic field vector of a single plane, making it suitable for use in position detection feedback systems. With a driving AC current of 60 mA, the sensitivity for the Y-axis magnetic field is 18.5 V/T, and for the Z-axis magnetic field, it is 2.9 V/T. In superimposed mode, simply adjusting the frequency and phase of the driving current can increase the Y-axis magnetic field sensitivity to 37.5 V/T, approximately doubling it. This enhancement allows for clear measurement of the geomagnetic field, enabling applications in orientation detection.
When measuring AC magnetic fields, a DC driving current of 1 mA is required. This allows for the measurement of the rotational speed and direction of a BLDC motor, which can be used for motor control.
關鍵字(中) ★ 微機電
★ 磁力計
★ 勞倫磁力
關鍵字(英) ★ coms
★ mems
論文目次 目錄
摘要 I
ABSTRACT II
誌謝 III
目錄 IV
圖目錄 VII
表目錄 XII
第一章 緒論 1
1.1 前言 1
1.2 研究動機與目的 2
1.3 文獻回顧 3
1.4 論文架構 9
第二章 感測介紹與公式推導 10
2.1感測架構 10
2.2 振動模型 11
2.3彈簧設計 13
2.4電容設計 18
2.5 讀取電路 19


第三章 元件設計與模擬 20
3.1 結構設計 20
3.2 模擬結果與分析 25
第四章 製程概述 31
4.1 CMOS結構概述 31
4.2 CMOS後製程概述 31
4.3 封裝概述 33
第五章 微結構與訊號介紹 34
5.1微結構靜態量測 34
5.2測量環境 36
5.3元件頻率響應 37
5.4量測訊號介紹 39
第六章 元件特性與分析 44
6.1同平面作動的電容感測訊號,量測Z軸磁場 45
6.2出平面作動的電容感測訊號,量測Y軸磁場 48
6.3元件訊號及靈敏度 49
6.4地磁量測 51
6.5 旋轉同動量測 52
第七章 應用實例 53
7.1直流磁場量測 53
7.2交流磁場量測 56
第八章 結論與討論 67
8.1結論 67
8.2延伸討論 67
參考文獻 68
參考文獻 [1] Herrera-May Agustin, Aguilera-Cortés Luz, Garcia, Pedro and Manjarrez Elias, “Resonant Magnetic Field Sensors Based On MEMS Technology. Sensors”, 2009, pp.7785-7813.
[2] H. Liang, S. Liu and B. Xiong, “Torsional Mems Magnetometer with Vertically Staggered Combs for in-Plane Magnetic Field Sensing,” 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS), Vancouver, BC, Canada, 2020, pp. 1171-1174.
[3] Y. Jung, E. Jo and J. Kim, “A Two-Axis Sensing Mems Magnetometer with Monolithic Moving Parts in Orthogonal Resonance Order,” 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS), Austin, TX, USA, 2024, pp. 44-47.
[4] M. Li et al., “Single-Structure 3-Axis Lorentz Force Magnetometer With Sub-30 Nt/√HZ Resolution,”2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS), San Francisco, CA, USA, 2014, pp. 80-83.
[5] Lin CH, Song CH, Wen KA. Multi-Function, “Microelectromechanical Systems Implementation with an ASIC Compatible CMOS 0.18 μm Process,” Micromachines (Basel). 2021.

[6] M. -H. Tsai, Y. -C. Liu and W. Fang, “A Three-Axis CMOS-MEMS Accelerometer Structure with Vertically Integrated Fully Differential Sensing Electrodes,” in Journal of Microelectromechanical Systems, vol. 21, no. 6, pp. 1329-1337.
[7] Sheng-Hsiang Tseng, Po-Chang Wu, Hann-Huei Tsai and Ying-Zong Juang, “Monolithic z-axis CMOS MEMS accelerometer,” Microelectronic Engineering, Volume 119, 2014, pp.178-182.
[8] C. H. Lin, C. H. Song, K. A. Wen, “Multi-Function Microelectromechanical Systems Implementation with an ASIC Compatible CMOS 0.18 μm Process,” Micromachines 2021, 12, 314.
[9] C. I. Chang, M. H. Tsai, Y. C. Liu, C. M. Sun and W. Fang, “Development of multi-axes CMOS-MEMS resonant magnetic sensor using Lorentz and electromagnetic forces, ” 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS), Taipei, Taiwan, 2013, pp. 193-196.
[10] C. H. Song and K. A. Wen, “Integration Design of Wide-Dynamic-Range MEMS Magnetometer and Oscillator,” 2018 IEEE International Conference on Semiconductor Electronics (ICSE), Kuala Lumpur, Malaysia, 2018, pp. 17-20.
[11] J. Ruggeri, J. Strube and K. M. Dowling, "3D Hall-Effect Magnetometer Using a Single Inverted Pyramid Structure," 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS), Austin, TX, USA, 2024, pp. 48-51.
[12] S. Lin, M. Lai and W. Fang, "Using Peacock Shape Anisotropic Magnetoresistance (AMR) and Ni Mushroom Array to Achieve Tri-Axis Magnetic Sensor," 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS), Austin, TX, USA, 2024, pp. 52-55.
[13] W. L. Sung, F. Y. Lee, C. L. Cheng, C. I. Chang, E. Cheng and W. Fang, “MEMS above CMOS process for single proof-mass 3-AXIS Lorentz-force resonant magnetic sensor, ” 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS), Shanghai, China, 2016, pp. 978-981.
[14] D. Rana and M. Kaur, “Design and simulation of CMOS MEMS accelerometer behavioral model,” 2016 5th International Conference on Wireless Networks and Embedded Systems (WECON), Rajpura, India, 2016, pp. 1-4.
[15] G. Laghi et al., "Torsional MEMS Magnetometer Operated off-Resonance for in-Plane Magnetic Field Detection," Sensors and Actuators, 2014.
[16] A. Aditi, S. K. Das, P. Kothari, S. Das, and R. Gopal, "Dual-axis Lorentz Force MEMS Magnetometer," 2020 IEEE Sensors Applications Symposium (SAS), pp. 1-4, 2020.
指導教授 陳世叡(Shih-Jui Chen) 審核日期 2024-6-25
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