摘要(英) |
In the past, the industry of the semiconductor followed Moore’’ s Law to development, however ,they find that when the process more shrink and then its manufacturing cost increase more quickly, and the material physical characteristic also have bottleneck. The semiconductor manufacturer breaks traditional thinking, combines the structure under designing with 3D IC with " More Moore " and " More than Moore " idea.
This research focuses upon the relationship between patent analysis and R&D planning. Patent analysis enables researchers and business executives to assess the competitive patent landscape prior to engaging in costly research and development, patent execution, or merger and acquisition activities. It is not only a powerful weapon in business but also a protective tool. Before planning R&D strategy, the companies have to analyze all related patents of the target technology.
This research try to figure out the relationship between patent analysis of 3D IC and R&D strategy from dissimilar view about technology life cycle, the sources of technology, R&D schedule and business model. This research also concludes that the companies should arrange different patent strategies and R&D plans in different developing stages.
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參考文獻 |
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