超音波振動輔助電泳沉積於石英微孔加工特性研究

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姓名

林萬迪(Wan-Ti Lin) 查詢紙本館藏

畢業系所

機械工程學系

論文名稱

超音波振動輔助電泳沉積於石英微孔加工特性研究
(Ultrasonic Vibration Assisted Electrophoretic Deposition for Machining Microholes in Quartz)

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摘要(中)

近年來由於微機電系統（Micro-Electro Mechanical System, MEMS）之蓬勃發展，MEMS之相關製程、應用逐漸受到矚目。其中超音波振動加工常被用於硬脆材料的加工，如玻璃、石英等。其加工原理是在刀具及材料間的磨粒受到超音波高頻率的振動驅使而撞擊材料，使材料產生微破裂進而去除材料的加工方式，由於製程簡單因此廣泛的應用於工業界。
本篇研究以超音波振動加工對石英微孔進行加工特性探討，並以結合電泳沈積法及超音波振動之複合拋光製程對加工後的微孔孔壁進行精微拋光的研究。由實驗結果得知，以磨料濃度30%、步進精度0.1µm、進給速度25µm/min、振幅5.4µm、轉速1000rpm之加工參數下，可成功的得到形狀完整之石英微孔。再以電壓5V、磨料濃度10%、電泳液pH 9，經1分鐘的電泳沉積後，可將SiC磨粒有效的沉積於碳化鎢刀具表面，並由超音波振幅6.3µm、刀具轉速2500rpm、研磨時間30min、磨料粒徑0.25µm的拋光下，可將超音波振動加工後之微孔表面粗糙度由Rmax0.48µm改善為Rmax0.08µm，其表面粗糙度改善率為83.3%。

摘要(英)

The micro ultrasonic vibration machining（MUSM）is a non-traditional method that able to machining the hardness and brittleness material like quartz. The basic structure of micro-fabrication is the micro-holes which can use to various applications. However, the vibration of high frequency during MUSM process causes the abrasive particles impact the workpiece by micro-chipping and filled with micro-craters in micro-holes. Hence, this study attempts to improve the quality of MUSMed micro-holes by a polishing method that combines electrophoretic deposition（EDP）and ultrasonic machining（USM）.
According to the result, the micro ultrasonic vibration machining can be fabricate with suitable parameters in MUSM, such as slurry concentration of 30 Wt%, step accuracy of 0.1µm, federate of 25µm/min, amplitude of 5.4µm and rotational speed of 1000rpm which can obtain accuracy micro-holes. After fabricate of micro-holes has done by MUSM process, the polishing parameters such as amplitude of 6.3µm, polishing time of 30min, rotation speed of 2500rpm and SiC particle size of 0.25µm can successfully finish the micro-holes which reduced the surface roughness from Rmax0.48µm to Rmax0.08µm.

關鍵字(中)

★ 石英
★ 超音波振動加工
★ 電泳沉積
★ 精微拋光

關鍵字(英)

★ quartz
★ micro ultrasonic vibration machining
★ electrophoretic deposition
★ polishing

論文目次

摘要 i
誌謝 iii
目錄 iv
圖目錄 vii
表目錄 x
第一章緒論 1
1-1 研究動機 1
1-2 文獻回顧 3
1-2-1 超音波振動加工相關文獻 3
1-2-2 電泳沉積相關文獻 4
1-3 研究目的與方法 5
第二章實驗原理 6
2-1 超音波振動加工基本原理 6
2-1-1 超音波振動加工的材料去除機制 6
2-1-2 超音波振動加工的優缺點 6
2-1-3 超音波錐體及喇叭的種類 7
2-1-4 超音波振動子 7
2-2 電泳沉積基本原理 9
2-2-1 電泳沉積簡介 9
2-2-2 電雙層 11
2-2-3 粉體粒子表面電荷來源 13
2-2-4 電泳沉積磨料之拋光機制 15
2-3 放電加工原理 16
2-3-1 放電加工去除機制 19
2-3-2 放電加工的優缺點 22
2-3-3 放電加工參數與影響 23
第三章實驗設備、材料與流程 26
3-1 實驗設備 26
3-1-1 放電加工機 27
3-1-2 線放電研削機構 29
3-1-3 X-Y Table電極旋轉夾持機構 30
3-1-4 超音波振動機構 31
3-1-5 精密移動平台 33
3-1-6 CCD（Charge Coupled Device）量測系統 33
3-1-7 電子天平 34
3-1-8 超音波洗淨機 34
3-1-9 去離子純水系統 35
3-1-10 電磁加熱攪拌器 35
3-1-11 低真空掃描式電子顯微鏡 36
3-1-12 原子力顯微鏡 36
3-1-13 pH測量計 37
3-1-14 直流電源供應器 37
3-1-15 蠕動泵浦 38
3-2 實驗材料 39
3-2-1 工件材料 39
3-2-2 工具電極材料 39
3-2-3 線電極材料 40
3-2-4 磨粒材料 40
3-3 實驗參數設定 41
3-3-1 刀具電極放電加工參數 41
3-3-2 超音波振動加工參數 41
3-3-3 電泳沉積參數 42
3-3-4 微孔精微拋光參數 42
3-4 實驗流程 43
第四章結果與討論 44
4-1 超音波振動於石英微孔加工特性研究 44
4-1-1 磨料濃度對微孔加工的影響 45
4-1-2 進給速度對微孔加工的影響 48
4-1-3 步進精度對微孔加工的影響 50
4-1-4 刀具轉速對微孔加工的影響 52
4-1-5 振幅對微孔加工的影響 55
4-2 超音波振動輔助電泳沉積於石英微孔拋光特性研究 57
4-2-1 電泳沉積參數探討 57
4-2-1-1 電極轉速及沉積時間對電泳沉積厚度之影響 58
4-2-1-2 磨料粒徑對電泳沉積厚度之影響 59
4-2-2 石英微孔之精微拋光參數探討 60
4-2-2-1 拋光時間對孔壁粗糙度的影響 61
4-2-2-2 刀具轉速對孔壁粗糙度的影響 62
4-2-2-3 磨料粒徑對孔壁粗糙度的影響 63
4-2-2-4 添加超音波振動對於孔壁粗糙度的影響 64
4-2-2-5 拋光後孔壁表面形貌 65
第五章結論 66
參考文獻 67

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指導教授

顏炳華(Biing-Hwa Yan)

審核日期

2009-7-27

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