目前國內半導體業者正積極投入設立12 吋晶圓廠，而半導體產業是屬於高資本投資的產業，興建一座半導體晶圓製造廠往往需要至少五至七佰億新台幣，且隨著新製程的改善，其所需的投資成本亦會隨著增加；再加上台灣土地狹小，價格昂貴，取得越來越不容易，以及晶圓廠本身的一些特性如廠房地板下需埋設管線設備以及晶圓製造的加工途程，具有高度的迴流（Reentrant），造成物料搬運活動非常頻繁，如果以傳統人工搬運車搬運晶圓，則效率必然低落等特性，使得晶圓廠一旦完工後，日後若想更改原始佈置顯得困難重重。因此，晶圓製造廠的佈置方式以及自動化搬運系統的配置在初期規劃階段就顯得格外的重要。 半導體產業中物流最佳化設計的目的是在於減少晶圓搬運損傷、提高良率及生產量、降低cycle time、減低在製品存量及縮短交期，因此，如何規劃出更有效率的廠房佈置，將有限的空間做最有效率的運用，進而提高生產績效、降低成本，成為現代製造系統中重要的一環，也成為企業獲益的重要因素。 本研究的主要動機在於運用設施規劃的方式，針對現有晶圓廠設施佈置及自動化物料搬運系統配置進行佈置改善，並透過啟發式演算法與數學模型來縮短晶圓間的搬運距離用以解決晶圓廠中Interbay系統的物料搬運問題，希望在考慮求解時間及解答品質下，得到一個最佳的佈置方案。同時更可以因為減少晶圓搬運距離而提高機器設備的使用率，並且降低晶圓的製造以及搬運成本。 In recent years, semiconductor manufacturing (SM) companies enthusiastically establish 300-mm fabs. However, establishing a new SM facility needs at least multi-billion US dollars. With the limited area in Taiwan, large footprints not only pose constraints for the facility designer but present challenge in the design of automatic material handling system (AMHS). SM is a highly sophiscated operation with various processes to be performed, and SM factories typically have reentrant flow to introduce the incresed number of process steps. In response to such challenge, it has become necessary to eliminate the manual handling of the wafers. As a result, facility layout design and AMHS are two major aspects to achieve a sucessful 300-mm fab. The purpose of the optimazation of material transport is to reduce cycle time, work in process (WIP), delivery time, and increase yield. Therefore, the approach attepmpted to incorporate facility layout and AMHS simulataneously has become a critical factor on factory operation. This paper focuses on using the integrated fab layout to achieve a short transportation distance of interbay by employing heuristic algorithm and mathematical programming model. In addition, this paper proposes this two-stage procedure can obtain a good quality solution. Based on this analysis, effective facility layout is shown to reduce tansportation distance of wafer lots, and increase equipment utility.
