Dewetting Retardation on Ag/Cu Coated Light Emitting Diode Lead Frames During the Solder Immersion Process

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題名:	Dewetting Retardation on Ag/Cu Coated Light Emitting Diode Lead Frames During the Solder Immersion Process
作者:	Huang,KC;Shieu,FS;Hsiao,YH;Liu,CY
貢獻者:	化學工程與材料工程學系
關鍵詞:	SURFACE FINISH;JOINTS;METALLURGY;RELIABILITY;CU6SN5;NI;SN
日期:	2009
上傳時間:	2010-06-29 17:26:38 (UTC+8)
出版者:	中央大學
摘要:	The process of SnPb immersion in Ag/Cu coated light emitting diode lead frames (LED LFs) (alloy 42) was investigated. SnPb solder was found to cause dewetting of the LF substrate after 6 s of immersion. We believed that the dewetting of the SnPb solder could be attributed to spalling of the interfacial compound grains. The addition of a small amount of Ni to the molten SnPb solder (0.1 wt.%) retarded that spalling and helped to prevent dewetting. The mechanisms for spalling retardation by the addition of Ni additives are as follows: (1) the Ni additives slow down the reaction rate between the molten SnPb solder and the Ag/Cu plating layer; (2) the Ni additives participate in interfacial reactions to form (Cu,Ni)(6)Sn-5 ternary compounds, which are more stable than binary compounds and have a slower ripening process.
關聯:	JOURNAL OF ELECTRONIC MATERIALS
顯示於類別:	[化學工程與材料工程研究所] 期刊論文

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