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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/26402


    Title: In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays (vol 38, pg 2308, 2009)
    Authors: Wu,AT;Tsai,CY;Kao,CL;Shih,MK;Lai,YS;Lee,HY;Ku,CS
    Contributors: 化學工程與材料工程學系
    Keywords: N/A
    Date: 2009
    Issue Date: 2010-06-29 17:27:14 (UTC+8)
    Publisher: 中央大學
    Abstract: N/A
    Relation: JOURNAL OF ELECTRONIC MATERIALS
    Appears in Collections:[化學工程與材料工程研究所] 期刊論文

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