Analytical solutions of film planarization for periodic features

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Title:	Analytical solutions of film planarization for periodic features
Authors:	Wu,PY;Chou,FC;Gong,SC
Contributors:	機械工程研究所
Keywords:	ROUGH ROTATING-DISK;THIN LIQUID-FILM;TOPOGRAPHY;SIMULATION;THICKNESS;MODEL;FLOW
Date:	1999
Issue Date:	2010-06-29 18:03:04 (UTC+8)
Publisher:	中央大學
Abstract:	Analytical solutions of film profiles and degree of planarization for periodic features during the spin coating process are presented. This article shows that the degree of planarization is independent of Omega(2) and changes slightly with the dimensionless line spacing alpha for Omega(2)> 300. The governing dimensionless parameter Omega(2) represents the ratio of centrifugal force to surface tension force during spin coating. In the cases of low Omega(2) (Omega(2)< 1), the degree of planarization decreases with increasing alpha for a fixed Omega(2). (C) 1999 American Institute of Physics. [S0021-8979(99)05120-8].
Relation:	JOURNAL OF APPLIED PHYSICS
Appears in Collections:	[Graduate Institute of Mechanical Engineering] journal & Dissertation

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