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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/27048

    Title: On the resistance of silver migration in Ag-Pd conductive thick films under humid environment and applied dc field
    Authors: Lin,JC;Chan,JY
    Contributors: 機械工程學系
    Date: 1996
    Issue Date: 2010-06-29 18:06:25 (UTC+8)
    Publisher: 中央大學
    Abstract: Silver migration occurring in pure silver conductive thick films was minimized by using Ag-Pd alloys. The in situ microscopic observation, under humid environment and an applied d.c. field, showed that the out-growth of silver dendrites from the cathode decreases with increasing (5-20%) amount of Pd in the Ag-Pd specimens, and ceases completely at 30% Pd. The enhancement of silver migration resistance with increasing Pd concentration in Ag-Pd conductors was evident by the measurements of the short circuit current between a couple of thick-him electrodes in distilled water at 5 V. Through the study of anodic potentiodynamic polarization in 0.01 M NaOH and the examination of the surface films on the thick films by X-ray diffraction and surface analyses (Auger and ESCA), it was found that the anodic formation of PdO blocks the silver dissolution, and minimizes the occurrence of silver migration.
    Appears in Collections:[機械工程研究所] 期刊論文

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