Effects of limited Cu supply on soldering reactions between SnAgCu and Ni

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Title:	Effects of limited Cu supply on soldering reactions between SnAgCu and Ni
Authors:	Ho CE,Lin YW,Yang SC,Kao CR,Jiang DS
Contributors:	材料科學與工程研究所
Keywords:	LEAD-FREE SOLDER;INTERFACIAL REACTIONS;SURFACE FINISH;METALLIZATION;JOINTS;ALLOYS;RELIABILITY;EVOLUTION
Date:	2006
Issue Date:	2010-07-06 15:59:08 (UTC+8)
Publisher:	中央大學
Abstract:	The volume difference between the various types of solder joints in electronic devices can be enormous. For example, the volume difference between a 760-mu m ball grid array solder joint and a 75-mu m flip-chip solder joint is as high as 1000 times. Such
Relation:	JOURNAL OF ELECTRONIC MATERIALS
Appears in Collections:	[Institute of Materials Science and Engineering] journal & Dissertation

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