Interfacial reaction issues for lead-free electronic solders

NCUIR > Engineering College > National Central University Department of Chemical & Materials Engineering > journal & Dissertation > Item 987654321/30331

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30331

Title:	Interfacial reaction issues for lead-free electronic solders
Authors:	Ho,C. E.;Yang,S. C.;Kao,C. R.
Contributors:	化學工程與材料工程研究所
Keywords:	SN-AG-CU;PB-FREE SOLDERS;THIN-FILM METALLIZATION;UNDER-BUMP METALLURGY;AG3SN PLATE FORMATION;FLIP-CHIP TECHNOLOGY;AU/NI SURFACE FINISH;GRID-ARRAY PACKAGES;NI-P;INTERMETALLIC COMPOUNDS
Date:	2007
Issue Date:	2010-07-06 16:17:01 (UTC+8)
Publisher:	中央大學
Abstract:	The interfacial reactions between Sn-based solders and two common substrate materials, Cu and Ni, are the focuses of this paper. The reactions between Sn-based solders and Cu have been studied for several decades, and currently there are still many un-res
Relation:	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] journal & Dissertation

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