Interfacial reaction issues for lead-free electronic solders

NCU Institutional Repository > 工學院 > 化學工程與材料工程研究所 > 期刊論文 > Item 987654321/30331

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题名:	Interfacial reaction issues for lead-free electronic solders
作者:	Ho,C. E.;Yang,S. C.;Kao,C. R.
贡献者:	化學工程與材料工程研究所
关键词:	SN-AG-CU;PB-FREE SOLDERS;THIN-FILM METALLIZATION;UNDER-BUMP METALLURGY;AG3SN PLATE FORMATION;FLIP-CHIP TECHNOLOGY;AU/NI SURFACE FINISH;GRID-ARRAY PACKAGES;NI-P;INTERMETALLIC COMPOUNDS
日期:	2007
上传时间:	2010-07-06 16:17:01 (UTC+8)
出版者:	中央大學
摘要:	The interfacial reactions between Sn-based solders and two common substrate materials, Cu and Ni, are the focuses of this paper. The reactions between Sn-based solders and Cu have been studied for several decades, and currently there are still many un-res
關聯:	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
显示于类别:	[化學工程與材料工程研究所] 期刊論文

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