Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu

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Title:	Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu
Authors:	Yang,S. C.;Ho,C. E.;Chang,C. W.;Kao,C. R.
Contributors:	化學工程與材料工程研究所
Keywords:	AU/NI SURFACE FINISH;INTERFACIAL REACTIONS;NI
Date:	2006
Issue Date:	2010-07-06 16:19:52 (UTC+8)
Publisher:	中央大學
Abstract:	The acute Zn concentration sensitivity of the reaction between Sn-based solders and Cu substrate is reported and explained in this article. Three Sn-xZn solders (x = 0.5, 0.7, and 2 wt%) were reacted with Cu substrates at 250 degrees C for 2-10 min. A sli
Relation:	JOURNAL OF MATERIALS RESEARCH
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] journal & Dissertation

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