Controlling the microstructures from the gold-tin reaction

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Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30481

Title:	Controlling the microstructures from the gold-tin reaction
Authors:	Tsai,JY;Chang,CW;Shieh,YC;Hu,YC;Kao,CR
Contributors:	化學工程與材料工程研究所
Keywords:	TRANSMISSION ELECTRON-MICROSCOPY;SOLDER JOINTS;MICROELECTRONIC PACKAGES;ROOM-TEMPERATURE;METALLIZATION;KINETICS;COUPLES;LASERS;NI/AU
Date:	2005
Issue Date:	2010-07-06 16:20:22 (UTC+8)
Publisher:	中央大學
Abstract:	The microstructures from the reaction between Au and Sn under different conditions were studied. A Su/Ni sandwich structure (2.5/3.752 mum) was deposited over the Si wafer. The overall composition of the Au and Sn layers corresponded to the Au20Sn bina
Relation:	JOURNAL OF ELECTRONIC MATERIALS
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] journal & Dissertation

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