Electromigration induced metal dissolution in flip-chip solder joints

NCUIR > Engineering College > National Central University Department of Chemical & Materials Engineering > journal & Dissertation > Item 987654321/30497

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30497

Title:	Electromigration induced metal dissolution in flip-chip solder joints
Authors:	Lin,YH;Tsai,CM;Hu,YC;Lin,YL;Tsai,JY;Kao,CR
Contributors:	化學工程與材料工程研究所
Keywords:	FAILURE
Date:	2005
Issue Date:	2010-07-06 16:20:44 (UTC+8)
Publisher:	中央大學
Abstract:	The failure of flip chip solder joints through the dissolution of the Cu metallization was studied. From the location and geometry of the dissolved Cu, it can be concluded that current crowding played a critical role in the dissolution. It can also be con
Relation:	PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] journal & Dissertation

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