Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization

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Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30522

Title:	Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization
Authors:	Huang,CP;Chen,C;Liu,CY;Lin,SS;Chen,KH
Contributors:	化學工程與材料工程研究所
Keywords:	INTERFACIAL REACTION;EUTECTIC SNPB;THIN-FILMS;JOINTS;MICROSTRUCTURE;RELIABILITY;TECHNOLOGY;BEHAVIOR;CU
Date:	2005
Issue Date:	2010-07-06 16:21:16 (UTC+8)
Publisher:	中央大學
Abstract:	Nickel has been widely used as an under-bump metallization (UBM) material in the microelectronics industry. The solid-state reaction between the eutectic SnAg solder bumps and three thicknesses of Ni/Cu UBM was investigated, with 5 mu m-Cu/3 mu m-Ni, 3 mu
Relation:	JOURNAL OF MATERIALS RESEARCH
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] journal & Dissertation

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