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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30599


    Title: Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints
    Authors: Tsai,CM;Luo,WC;Chang,CW;Shieh,YC;Kao,CR
    Contributors: 化學工程與材料工程研究所
    Keywords: LEAD-FREE SOLDERS;INTERFACIAL REACTIONS;COMPOUND FORMATION;CU CONCENTRATION;MICROELECTRONIC PACKAGES;SHEAR-STRENGTH;NI;METALLIZATION;AU/NI;TECHNOLOGY
    Date: 2004
    Issue Date: 2010-07-06 16:23:04 (UTC+8)
    Publisher: 中央大學
    Abstract: The cross-interaction of the under-bump metallurgy (UBM)/solder interface and the solder/surface-finish interface in flip-chip solder joints was investigated. In this study, the UBM on the chip side was a single layer of Cu (8.5 mum), and the surface fini
    Relation: JOURNAL OF ELECTRONIC MATERIALS
    Appears in Collections:[化學工程與材料工程研究所] 期刊論文

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