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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30673


    Title: A study on the reaction between cu and Sn3.5Ag solder doped with small amounts of Ni
    Authors: Tsai,JY;Hu,YC;Tsai,CM;Kao,CR
    Contributors: 化學工程與材料工程研究所
    Keywords: SN-AG;INTERFACIAL REACTIONS;GROWTH;MICROSTRUCTURE;SUBSTRATE
    Date: 2003
    Issue Date: 2010-07-06 16:24:46 (UTC+8)
    Publisher: 中央大學
    Abstract: The reaction between Cu and the Sn-Ag solders doped with different amounts of Ni is studied. Four different solders with the Ag concentration fixed at 3.5 wt.% and Ni concentrations varied between 0.0 wt.% and 1.0 wt.% are used. In contrast to the reactio
    Relation: JOURNAL OF ELECTRONIC MATERIALS
    Appears in Collections:[化學工程與材料工程研究所] 期刊論文

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