English  |  正體中文  |  简体中文  |  Items with full text/Total items : 67783/67783 (100%)
Visitors : 23048068      Online Users : 182
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version

    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30998

    Title: Formation and resettlement of (AuxNi1-x)Sn-4 in solder joints of ball-grid-array packages with the Au/Ni surface finish
    Authors: Ho,CE;Zheng,R;Luo,GL;Lin,AH;Kao,CR
    Contributors: 化學工程與材料工程研究所
    Keywords: AU FOILS
    Date: 2000
    Issue Date: 2010-07-06 16:32:36 (UTC+8)
    Publisher: 中央大學
    Abstract: The interfacial reactions between eutectic PbSn solder and the solder ball pads with the Au/Ni surface finish were studied. Solder joints subjected to up to three repeated reflow-and-aging treatments were examined. For the reflow, the peak reflow temperat
    Appears in Collections:[化學工程與材料工程研究所] 期刊論文

    Files in This Item:

    File Description SizeFormat

    All items in NCUIR are protected by copyright, with all rights reserved.

    社群 sharing

    ::: Copyright National Central University. | 國立中央大學圖書館版權所有 | 收藏本站 | 設為首頁 | 最佳瀏覽畫面: 1024*768 | 建站日期:8-24-2009 :::
    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - Feedback  - 隱私權政策聲明