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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30998


    Title: Formation and resettlement of (AuxNi1-x)Sn-4 in solder joints of ball-grid-array packages with the Au/Ni surface finish
    Authors: Ho,CE;Zheng,R;Luo,GL;Lin,AH;Kao,CR
    Contributors: 化學工程與材料工程研究所
    Keywords: AU FOILS
    Date: 2000
    Issue Date: 2010-07-06 16:32:36 (UTC+8)
    Publisher: 中央大學
    Abstract: The interfacial reactions between eutectic PbSn solder and the solder ball pads with the Au/Ni surface finish were studied. Solder joints subjected to up to three repeated reflow-and-aging treatments were examined. For the reflow, the peak reflow temperat
    Relation: JOURNAL OF ELECTRONIC MATERIALS
    Appears in Collections:[化學工程與材料工程研究所] 期刊論文

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