AlGaInP/GaP light-emitting diodes fabricated by wafer direct bonding technology

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題名:	AlGaInP/GaP light-emitting diodes fabricated by wafer direct bonding technology
作者:	Chang,SJ;Sheu,JK;Su,YK;Jou,MJ;Chi,GC
貢獻者:	物理研究所
關鍵詞:	GAP WINDOW LAYER
日期:	1996
上傳時間:	2010-07-08 14:07:03 (UTC+8)
出版者:	中央大學
摘要:	An AlGaInP/GaP light-emitting diode was fabricated by wafer direct bonding technique. The device was grown on GaAs substrate by metalorganic vapor phase epitaxy (MOVPE). After bonding the n-GaP substrate on top of the epitaxial layers, the original GaAs substrate was removed. The luminous intensity of this wafer-bonded device is around 60 mcd/S-r at an operation current of 20 mA. It is about two times brighter than the conventional device with absorbing GaAs substrate. The large lattice constant mismatch (3.6%) between wafer-bonded GaP substrate and GaInP did not degrade the device characteristics.
關聯:	JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
顯示於類別:	[物理研究所] 期刊論文

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