本論文建立一晶圓定位系統以量測在製程腔體中移動晶圓之圓心位置。定位系統中使用三組光遮斷感測器做為感測模組，排列在機械手臂移動之路徑上，撰寫電腦整合程式依據光學感測模組所接收之時序訊號以計算晶圓圓心。所發展之電腦整合程式包含人機操作介面、並具有判斷晶圓移動方向與缺口/帄邊是否通過感測器之功能。 定位實驗部分，在實驗室以四吋晶圓及八吋晶圓進行實驗，驗證所建立晶圓定位系統之可行性。接著將定位系統與產業用成膜設備整合，並以八吋晶圓及十二吋晶圓進行實驗測試。十二吋晶圓整合測試之定位準確度為0.30mm，定位精確度為0.10mm。 This thesis implements a wafer positioning system for real-time detection of the center position of a moving wafer in a process chamber. Three pairs of optical sensors positioned along an axis transverse to the path of movement of wafer are employed in this wafer positioning system, and a computer program capable of wafer center calculation is developed. The developed computer program computes the wafer center position as well as its moving direction based on the time dependent signals from the optical sensing module. The computer program contains a human machine interface, function of notch/flat judgment and determination of the moving direction. Experiments of 4" and 8" wafer are successfully performed in the laboratory. Then, the wafer positioning system is integrated with a semiconductor manufacturing equipment. The center positions of the 8" and 12" wafers have been measured to understand the precision of the system. According to the experimental results, the accuracy of 12" wafer center detection is 0.30mm and the measurement standard deviation is 0.10mm.
