Variation of Mechanical Property and Microstructure across Sn Solder Joint in Cu/Sn/Ni Structure

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Title:	Variation of Mechanical Property and Microstructure across Sn Solder Joint in Cu/Sn/Ni Structure
Authors:	Liu,CY;Tseng,HW;Song,JM
Contributors:	化學工程與材料工程學系
Date:	2010
Issue Date:	2012-03-27 16:26:22 (UTC+8)
Publisher:	國立中央大學
Abstract:	A variation in microstructure and mechanical property (microhardness) was observed across the Cu/Sn/Ni solder joint. The microhardness of the Sn solder joint monotonically decreases away from the Cu side toward the Ni side. A coarser shear band occurred in the indentation marks of the solder matrix near the Ni side. The above findings imply that the solder matrix with a hypoeutectic microstructure near the Ni side has lower mechanical strength. The hypereutectic microstructure near the Cu side has higher mechanical strength. (C) 2010 The Electrochemical Society. [DOI: 10.1149/1.3447865] All rights reserved.
Relation:	ELECTROCHEMICAL AND SOLID STATE LETTERS
Appears in Collections:	[Department of Chemical and Materials Engineering] journal & Dissertation

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