Variation of Mechanical Property and Microstructure across Sn Solder Joint in Cu/Sn/Ni Structure

NCU Institutional Repository > 工學院 > 化學工程與材料工程學系 > 期刊論文 > Item 987654321/49915

請使用永久網址來引用或連結此文件: http://ir.lib.ncu.edu.tw/handle/987654321/49915

題名:	Variation of Mechanical Property and Microstructure across Sn Solder Joint in Cu/Sn/Ni Structure
作者:	Liu,CY;Tseng,HW;Song,JM
貢獻者:	化學工程與材料工程學系
日期:	2010
上傳時間:	2012-03-27 16:26:22 (UTC+8)
出版者:	國立中央大學
摘要:	A variation in microstructure and mechanical property (microhardness) was observed across the Cu/Sn/Ni solder joint. The microhardness of the Sn solder joint monotonically decreases away from the Cu side toward the Ni side. A coarser shear band occurred in the indentation marks of the solder matrix near the Ni side. The above findings imply that the solder matrix with a hypoeutectic microstructure near the Ni side has lower mechanical strength. The hypereutectic microstructure near the Cu side has higher mechanical strength. (C) 2010 The Electrochemical Society. [DOI: 10.1149/1.3447865] All rights reserved.
關聯:	ELECTROCHEMICAL AND SOLID STATE LETTERS
顯示於類別:	[化學工程與材料工程學系 ] 期刊論文

文件中的檔案:

檔案	描述	大小	格式	瀏覽次數
index.html		0Kb	HTML	454	檢視/開啟

在NCUIR中所有的資料項目都受到原著作權保護.

社群 sharing