The Development of a Real-Time Image Guided Micro Electroplating System

NCUIR > Engineering College > Departmant of Mechanical Engineering > journal & Dissertation > Item 987654321/50174

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/50174

Title:	The Development of a Real-Time Image Guided Micro Electroplating System
Authors:	Chen,TC;Hwang,YR;Lin,JC;Ciou,YJ
Contributors:	機械工程學系
Keywords:	LOCALIZED ELECTROCHEMICAL DEPOSITION;ANODE
Date:	2010
Issue Date:	2012-03-27 17:05:24 (UTC+8)
Publisher:	國立中央大學
Abstract:	A real-time image guided continuous micro-electroplating system equipped with four elements, such as a Charge-coupled Device camera (CCD camera), a magnifier lens, a micro-stepper motor controller, and micro-electroplating device, is proposed in this paper. To maintain the electroplating quality, the system continuously controls the micro-stepper motor and keeps constant gap distance between the micro-anode and copper specimen. In the process of electroplating, chemical reactions would generate oxygen bubbles automatically thus to deteriorate captured images. To solve the bubble issue, a real-time image of the distance between the copper column tip and the anode captured by a CCD camera is used to determine and adjust the cathode position. Besides, four statistic judging criterions are used and compared to determine the bubble-free images. Based on the processing time and accurate rate, the algorithm using entropy index is proposed in this paper for real-time control. From the experiment results, a real-time image guided micro electroplating system does produce better structure, better uniformity and better finishing surface of the specimens compared to those by previous intermittent electroplating setup.
Relation:	INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE
Appears in Collections:	[Departmant of Mechanical Engineering ] journal & Dissertation

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