The Development of a Real-Time Image Guided Micro Electroplating System

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題名:	The Development of a Real-Time Image Guided Micro Electroplating System
作者:	Chen,TC;Hwang,YR;Lin,JC;Ciou,YJ
貢獻者:	機械工程學系
關鍵詞:	LOCALIZED ELECTROCHEMICAL DEPOSITION;ANODE
日期:	2010
上傳時間:	2012-03-27 17:05:24 (UTC+8)
出版者:	國立中央大學
摘要:	A real-time image guided continuous micro-electroplating system equipped with four elements, such as a Charge-coupled Device camera (CCD camera), a magnifier lens, a micro-stepper motor controller, and micro-electroplating device, is proposed in this paper. To maintain the electroplating quality, the system continuously controls the micro-stepper motor and keeps constant gap distance between the micro-anode and copper specimen. In the process of electroplating, chemical reactions would generate oxygen bubbles automatically thus to deteriorate captured images. To solve the bubble issue, a real-time image of the distance between the copper column tip and the anode captured by a CCD camera is used to determine and adjust the cathode position. Besides, four statistic judging criterions are used and compared to determine the bubble-free images. Based on the processing time and accurate rate, the algorithm using entropy index is proposed in this paper for real-time control. From the experiment results, a real-time image guided micro electroplating system does produce better structure, better uniformity and better finishing surface of the specimens compared to those by previous intermittent electroplating setup.
關聯:	INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE
顯示於類別:	[機械工程學系] 期刊論文

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