新產品開發為一個具有高度互動性的流程，隨著電子產品所需處理的複雜度不斷上升之趨勢下，使得新產品的開發越來越為困難。而產品的生命週期卻越來越短，往往僅有六個月，近八成的利潤來自於新產品推出的前三個月，新產品需能即時上市，以因應市場多變化之需求。因此產品開發流程需要透過協同設計的方式來進行。設計鏈作業參考模型（Design-Chain Operations Reference- model, DCOR）主張能透過該模式幫助企業進行設計鏈分析與促進成員溝通，企業可以用其提供之共通專業術語，分析和設計其設計鏈作業所需之架構與流程，並建立設計鏈之基本架構。本研究以台灣半導體基板（substrate，為半導體下游產業晶片封裝之關鍵零組件）為主要探討對象，以流程導向及階層式之架構手法，分析基板設計與驗證之流程，並透過DCOR與設計結構矩陣（Design Structure Matrix, DSM）發掘問題並提出改善建議，以簡化設計流程及設計時不必要的浪費，以提升基板設計鏈效率。New product development is a highly interactive process, with the trend of rising complexity of electronic products, new product development is increasingly difficult. Product life cycle become shorter only remaining six months, 80% of the profits from first three months of launch new product. New products needs onto the market immediately to response the demand. Therefore, new product development must through the collaborative design to improvement process.DCOR can help enterprises to analyze the design chain and facilitating member communication. Enterprise can use the standard language to analyze the design chain operations required and establish the basic structure of design chain.This study is a case study for Taiwan semiconductor substrate. Substrate is the key of the package for semiconductor downstream industries. We used the process-oriented and hierarchical architecture practices to analyze the design and verification substrate process. Through the DCOR and DSM to explore problem and give suggestion, in order to simplify the process of unnecessary waste and enhance the efficiency of substrate design chain.
