| 摘要: | 積體電路載板產業在產業中屬於技術密集、知識密集、資金密集以及附加價值高的產業。積體電路載板產業供應鏈，依循「傳統電路板」產業的成功經驗模式，已形成「積體電路載板」垂直供應鏈。因此臺灣已經成為全球主要品牌經營者及製造廠所倚賴的重要代工廠商及產品研發合作的夥伴。由於半導體產業仍朝多功能、高密度、小尺寸晶片趨勢發展，雖然陸續有競爭者切入積體電路用載板市場，惟此類產品已逐漸被廣泛地運用在各項3C電子商品中，包括電腦中央處理器(CPU)、晶片組、手機、手機用射頻模組晶片(RF module)、網路通訊晶片、數位電視及機上盒晶片組等產品，故整體市場成長尚稱穩定。本研究採個案研究方式，藉由在國內積體電路載板產業市場上具有相當影響力的公司--N公司為討論個案研究對象，將研討分析廠商如何在市場上產業環境變遷及其所面臨之內外部競爭考量下，建立其所需之發展策略。在研究中發現，面對未來競爭，積體電路載板廠商除持續不斷提升技術並與半導體產業同步演進開發外，針對產品品質的提升及快速市場時效需求符合電子產品生命週期，更是不可忽略的重要因子。IC substrate industry is technology-intensive, knowledge-intensive, capital-intensive, and high value-added. Following the successful experience of Taiwan PCB industry, a vertical supply chain of IC substrate has developed in Taiwan. Therefore, major IC brands worldwide all rely on the manufacturing and R&D capabilities of Taiwanese firms, making these Taiwanese firms their major OEM partners.Although new competitors continuously enter into the IC substrate industry, its market still shows steady growth due to the widespread application of IC with multi-function, high I/O density and small form-factor on 3C products, including CPU, chipset, 3G mobile phone, RF module, network/communication, digital TV, TV box and so on.“Case Study” is used in this thesis to analyse the case of how Company N, a major manufacturer of IC substrate in the domestic market, constructs a strategic plan for the future development, after considering the changing of technical environment as well as the competition it faces.This research shows that IC substrate manufacturers should keep on promoting techniques so as to evolve with the semiconductor industry. Besides, product quality improvement and fast development for new products to meet the short lifecycle of electronic products are all the critical factors to success in this industry. |
