無鉛熔錫波銲製程實驗之探討;Experiments of lead-free wave soldering investigate process

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题名:	無鉛熔錫波銲製程實驗之探討;Experiments of lead-free wave soldering investigate process
作者:	賴振同;Lai,Cheng-tung
贡献者:	機械工程學系在職專班
关键词:	實驗設計;design of experiments
日期:	2013-01-24
上传时间:	2013-03-25 16:20:32 (UTC+8)
出版者:	國立中央大學
摘要:	科技的發展開發了具備多功能的新產品，在這些新產品的製造過程中，銲接技術正面臨一波新的挑戰，銲接後接點的品質也受到嚴重之考驗，在銲接技術中，熔錫波銲製程是一個產業常用的方法，在銲接製程中，使用無鉛銲料代替有鉛焊料傾向於修改操作條件，影響熔錫波銲的因素相當多，包含設計不良、板材鑽孔粗糙度、PCB水氣、組件儲存與管控、零件與孔徑設計間隙值、通孔鍍層不均與腳鍍層氧化厚度等問題都可能產生不銲接缺陷，而影響到產品的銲接性能。本論文嘗試利用實驗設計法來探討無鉛熔錫波銲製程之最佳化，希望找出熔錫波銲製程缺陷的主要影響因數，並依研究結果，設計出熔錫波銲製成的最佳參數，以降低銲接之缺陷。例如在PCB孔徑與插件腳間隙值的設計方面，必須在考量縮小插件腳孔尺寸與其所造成之插件難度增加，找出合理之平衡值，製程環境的溼度、溫度控制也必須嚴密控制，才能確保熔錫波銲製程的品質與穩定度。利用實驗設計法預估所得的最佳波銲條件，實際應用波銲實驗顯示出相當吻合之對照結果，因此本實驗設計法相當適合於波銲製程品質管控之改善。AbstractMany innovative products have been manufactured by modern technologies soldering process,acting as a key technology in the manufacturing process faces a new challenges ,since the strick requirement on the quality of solder joint. Among the soldering technologies, wave soldering process is adopted a popular methods in the industy . The use of Pb-Free solders in place of Pb-Sn solders inclined to modify the operational conditions in the soldering process , wave soldering of factors impactis is quite many factors,including improper design,roughness of drilling hole size on the board ,moisture PCB content in the storage components, improper clearance between the size and the aperture of the holes, non-uniform deposit in the through-holes and pins of coated with various thickness of oxides etc,haved been found to affect the performance of soldering. In this dissertation, the author try to investigate the optimization of the lead-free wave soldering process to have been found to means of the technique by design of experiments method. The purpose of this work is to find out the most important factors in the wave soldering process dominating the solder quality .As a result optimal parameters were selected following by using of design of experiments to rule out many possible soldering defect. For examples the clearance at various levels should be set to a blance value between the pin size and the hole size on the board. A greater clearance is necessary a between the pin and hole when a bent pin need to be plugged in the hole, the humidity and temperature of processing environment should be strictly controlled in order to ensure the quality and stability of the solders,there is a good consistent between the experimental result of wave-soldering process performed under the optimal conditions selected by means of design of experiments and the theorectical results predicted according to design of experiments .This consistence implied that design of experiments is an applicable technique suitable for quality control in wave-soldering process.
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