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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/60466

    Title: 應用迴歸分析於線切割製程有效切割時間分析-以太陽能矽晶圓產業為例
    Authors: 劉千暘;Liu,Chien-Yang
    Contributors: 工業管理研究所在職專班
    Keywords: 迴歸分析;多晶太陽能晶片;有效切割時間;Regression analysis;multi-crystalline solar wafers;effective cutting time
    Date: 2013-07-24
    Issue Date: 2013-08-22 11:38:11 (UTC+8)
    Publisher: 國立中央大學
    Abstract: 隨著全球暖化情形日益嚴重,各項再生能源不斷被討論及普及化。在這個背景下太陽能發電佔全球再生能源比重越來越高,同時太陽能產品應用也越來越多元化;同時在日本核災的催化下太陽能發電需求亦被引爆。
    As the global warming gets worse day by day, all kinds of renewable energy resources are continuously discussed and popularized. In such a situation, solar power electricity generation has an increasing proportion of global renewable energy, and solar power appliances become more and more diverse. Meanwhile, the Fukushima Daiichi nuclear disaster also triggers the growth of solar power electricity generation.
    Currently solar wafer made by polycrystalline silicon are the mainstream in the global market of solar power electricity generation. This research focuses on the effective cutting time factors analysis of solar wafer wire saw procedure, and mainly discusses a range of eleven independent variables: wire-speed, cut-speed, flow_Top, density_Top, temperature_Top, flown_Bot, density_Bot, temperature_Bot, take-up tension, new wire tension and Slurry temperature by using actual measured figures between February and March 2013 from a national solar wafer leading company. This research is to collect and analyze efficient cutting time data in the actual condition that no breaking wire saw happens.
    The research result shows that by using regression analysis to predict efficient cutting time, the 75.6% changes are caused by the variance of four variables: wire-speed, flown_Bot, density_Bot, and Slurry temperature. Therefore, above four variables’ change has highly positive impact on the occurrence of breaking wire, which might be a reference of improving the situation of breaking wire to the solar wafer industry.
    Appears in Collections:[工業管理研究所碩士在職專班 ] 博碩士論文

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