考量雙圖案微影技術之電路軌道繞線;Track Routing for Double Patterning Technology

NCUIR > College of Electrical Engineering & Computer Science > Department of Electrical Engineering > Research Project > Item 987654321/63064

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/63064

Title:	考量雙圖案微影技術之電路軌道繞線;Track Routing for Double Patterning Technology
Authors:	陳泰蓁
Contributors:	國立中央大學電機工程學系
Keywords:	電子電機工程;資訊科學;軟體
Date:	2012-12-01
Issue Date:	2014-03-17 14:18:10 (UTC+8)
Publisher:	行政院國家科學委員會
Abstract:	研究期間：10108~10207;As the manufacturing process advances, the size of integrated circuits has shrunk into the 32 nm. Lithography process encounters a bottleneck due to printability and manufacturability issues. Recently, double patterning lithography (DPL) has been proposed for the most feasible solution for sub-32-nm node process. To increase the half-pitch resolution and improve depth of focus, DPL decomposes a layout into two masks by using current infrastructures. The conflict of DPL means that a layout cannot be decomposed completely, and then the un-decomposable pattern must be partitioned into two sub-patterns. These two sub-patterns should be assigned to different masks and connected to each other. The touching edge of sub-patterns is called stitch. If there is no enough space to insert a stitch for the un-decomposable pattern, a native conflict is generated. A layout with native conflicts will result in layout modification. The current researches focus on reducing the number of stitches and the number of native conflicts in the post layout phase or detailed routing phase. Since the layout is more and more complicated, considering DPL before detailed routing and alleviating the loading in detailed routing will be a challenge. In this project, we propose a method to consider DPL in track routing. Besides, we propose a pseudo pin technique to avoid generating a lot of native conflicts in track routing and predict the traces of detailed routing.
Relation:	財團法人國家實驗研究院科技政策研究與資訊中心
Appears in Collections:	[Department of Electrical Engineering] Research Project

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