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|Keywords: ||台灣半導體封測產業;商業模式;經營績效;Taiwan’s semiconductor packaging and testing industry;Business model;Business performance|
|Issue Date: ||2014-10-15 15:30:44 (UTC+8)|
|Abstract: ||全球半導體景氣劇烈起伏、晶圓製造技術推進和電子產品朝向輕、薄、短、小的趨勢發展，使封裝測試技術難度及投資門檻均提高的情況下，國際IDM 大廠紛紛出售其麾下不具競爭力的封裝測試部門或將新增的封裝測試需求外包至專業封裝測試廠。|
本研究依據改變後的商業模式，提供個案公司未來經營成果及獲利能力的分析。;While global semiconductor industry booming and slumping vigorously, wafer manufacturing technology advances toward light, thin, short, small trends. Due to the increasing difficulty packaging and testing technology and investment barriers, the international IDM companies have to sell their less competitive packaging and testing department or outsource new demands to professional packaging and testing companies.
The company case of packaging and testing are focused their expanded production capacity on their core business for many years and such investment is fairly good. Taiwan, within the global semiconductor manufacturing supply chains , in recent years has become the heartland that the Fabless, IDM companies actively continue to migrate their capacities in high-end products , advanced process and low-cost solution to. There are many company expansions and significant investments in Taiwan′s semiconductor industry in 2013.
Semiconductor industry is economy of scale, the company case faces intense competition in the industry. It is the key to survival of how to expand the operation scale and seek for outsourcing orders to strengthen profitability. Facing the development of technology, how to timing acquire the information and advanced packaging and testing technology for maintaining industrial competitiveness is highly tied to the company long-term development.
In this study, the company case is analyzed with 8 十national model of opportunities and threats in the external environment; analyzed based on 8 十business model of the company’s competitor strengths and weaknesses; analyzed with 8 十profit model of the company’s and their competitors’ operation performances and financial positions. Furthermore, by using SWOT analysis on the company’s competitive strategy to identify the company′s business problems and countermeasures, and finally provide the company case new business model and financial forecast. The whole study is suggested as a reference.
The conclusions are as following:
With the development trend of professional divisions in the semiconductor industry, IDM company gradually increase the proportion of production commissioned by external professional foundry based on cost-benefit considerations and financial risks.
● The company case will be able to acquire IDM significant orders and raise revenues.
The expanded numbers of IC and output growing of upstream semiconductor companies, the future can be expected. The inter-dependence and mutual development for common prosperity are required between customers and manufacturers.
●The company case and the business competitors maintain the relationships of both competition and cooperation. The bigger the stronger, to enhance their competitive advantage.
This study, according to the changed business model, provides analysis of future corporate business results and profitability.
|Appears in Collections:||[高階主管企管（EMBA）碩士班] 博碩士論文|
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