運用六標準差手法提升手機主板之LTE RF測試良率-以H公司為例

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題名:	運用六標準差手法提升手機主板之LTE RF測試良率-以H公司為例
作者:	蘇品誌;Su, Pin-Chih
貢獻者:	工業管理研究所在職專班
關鍵詞:	RF測試;六標準差方法;DMAIC
日期:	2017-06-06
上傳時間:	2017-10-27 12:29:09 (UTC+8)
出版者:	國立中央大學
摘要:	六標準差是一種整合性的品質管理方法，應用科學的方法作流程分析，了解數據呈現的事實，找出關鍵品質特性，以改善企業的流程品質。本論文應用六標準差的DMAIC方法來降低電路板組裝廠的主板LTE測試不良率。定義階段，聆聽顧客的聲音，明確的定義目標並轉成量化的數據，訂一個可以衡量的目標值，確定改善的目標能滿足顧客的需求。量測階段，評估和了解一個流程的現況，了解流程的績效表現，運用GR&R來評估量測系統的可用性。分析階段，用特性要因圖(魚骨圖)去分析造成此變異之不同來源，決定造成此變異的可能原因並轉寫成失效模式及效應分析(FMEA)加以追蹤。改善階段，利用分析出的結果去改善流程，調整至最佳化去解決主要變異的來源，用失效模式及效應分析(FMEA)確認其影響程度是否改善。控制階段，將解決方案標準化並導入流程並交與後續的擁有者，建立流程管制計畫確保流程改善後的效果穩定及符合顧客的要求。本研究針對分析結果提出改善方案，其改善後之效益為降低不良率從10.44％降至0.21％，節省電路板廠的重工費用為台幣4506050.25元。;Six Sigma is an integrated quality management approach, the application of scientific methods for process analysis, to understand the facts of the data presented and identify key quality characteristics to improve the quality of enterprise processes. In this thesis, DMAIC approach of Six Sigma is used to reduce the circuit board assembly plant motherboard LTE test failure rate. In "Define", listen to the customer′s voice, clearly define the target and turn into quantitative data, set a measurable target value, to determine the improvement of the target to meet customer needs. In "Measurement", assess and understand the status of a process, understand the performance of the process, the use of GR&R to assess the availability of measurement systems. In "Analysis", Cause and Effect Diagram (Fishbone Diagram) are used to analyze the different causes of this variation, and the possible causes of this variation are determined and transferred to failure mode and effect analysis (FMEA) to be tracked. In "Improve", use the results of the analysis to improve the process, adjust to optimize to solve the main source of variation, with failure mode and effect analysis (FMEA) to confirm whether the impact of improvement. In "Control", standardize the process and import the process and submit to the follow-up owners, the establishment of process control program to ensure that the process after the improvement of the results of stability and meet customer requirements. In this study, we propose an improvement plan for the analysis results. The improvement rate of the improvement is reduced from 10.44% to 0.21%, and the cost of rework for the circuit board is NT $ 4506050.
顯示於類別:	[工業管理研究所碩士在職專班 ] 博碩士論文

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