電子組裝業SMT生產流程之探討

NCUIR > School of Management at National Central University > Executive MBA > Electronic Thesis & Dissertation > Item 987654321/74393

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/74393

Title:	電子組裝業SMT生產流程之探討
Authors:	林孟儒;Lin, Meng-Ju
Contributors:	高階主管企管碩士班
Keywords:	表面黏著技術;庫存;成本;效率;競爭力;SMT;inventory;cost;efficiency;competitiveness
Date:	2017-05-15
Issue Date:	2017-10-27 13:51:23 (UTC+8)
Publisher:	國立中央大學
Abstract:	本研究利用個案研究法，探討如何在電子組裝廠SMT(表面黏著技術)生產流程中予以改善，強化供應鏈能力，提高庫存週轉率、減少人員搬運、提升品質、降低成本、提高客戶滿意等，在各種能力提升下，以提升企業競爭力為目標。本研究在製程及流程上達到了以下的改善：精簡了電子組裝廠SMT生產流程；降低庫存；降低成本、提高效率和品質，以及提升了公司競爭力。;This study uses case study method to examine how a company improves the SMT manufacturing process to enhance its competitiveness. The improvement of manufacturing process is expected to strengthen a company’s supply chain, increase its inventory turnover, product quality and customer satisfaction, meanwhile, lower cost and personnel handling. This study makes contributions to the company by streamlining its manufacturing process, cutting costs and reducing inventory, at the same time, improve its efficiency, product quality and competitiveness.
Appears in Collections:	[Executive MBA] Electronic Thesis & Dissertation

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