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    請使用永久網址來引用或連結此文件: http://ir.lib.ncu.edu.tw/handle/987654321/74871


    題名: 應用標準化測試轉換為Z-score的晶圓 非系統性錯誤分析;Standardized to Z-score for Non-uniform Testing of Wafer Map Analysis
    作者: 許民杰;Hsu, Min-Chieh
    貢獻者: 電機工程學系
    關鍵詞: 非系統性錯誤分析;Non-uniform Testing
    日期: 2017-07-19
    上傳時間: 2017-10-27 16:10:01 (UTC+8)
    出版者: 國立中央大學
    摘要: 本篇論文為對已分類之瑕疵晶圓圖,以過去提出之迴力棒特徵圖,將這些晶圓圖瑕疵分佈的均勻性以巨觀的概念做更深入的分析以及驗證。
    首先,我們先對量產化晶圓產品選擇出欲對比的數種尺寸,再分別模擬尺寸的瑕疵均勻分佈迴力棒圖形做為基準曲線。此次實驗中,將對此組所選取的資料對各個晶圓圖產生出參數NBD、NCD,再將這兩個參數除上晶粒做正規化之產生NNBD及NNCD兩個參數,根據兩個參數獲得標準偏差,並與基準標準差值進行比較,觀察每種故障類型對值的變化,我們將判斷晶圓是否均勻,並觀察是否有瑕疵晶粒過度群聚的情況。最後,我們將根據結果來查看非分類數據是否存在系統錯誤。

    在本實驗中,我們使用標準差與常態分佈的關係,透過觀察特徵數值來分辨出是否為系統性錯誤類型,再依據損壞晶粒的群聚情形以及位置,檢視其瑕疵分布的均勻性。最後透過未分類的資料驗證Z-SCORE特徵數值的實用性,進而達到提高良率、測試效率以及降低成本的目的。

    ;In this paper, we use Boomerang Chart that we published in the past to analyze the classified wafer maps in a great view, whether the distribution of defects uniform or not and verify it in mass production.
    At first, we choose several kinds of size of wafers that we would like to analyze, and simulate basic curve according to these several kinds of size. In this experiment, we will create parameters NBD and NCD from every wafer in every data, and normalize the two parameters to create two new parameters, NNBD and NNCD. We will get the standard deviation according to the two parameters and compare with basic standard deviation to observe every failure type’s on the change in value, we will judge whether a wafer uniform or not and the situation of clustering of bad dice by this. Then, we will view whether there are systematic errors in non-classified data based on the result.

    In this experiment, we use the relationship between standard deviation and normal distribution , To identify whether the system is a systematic error type by observing the feature value , and find out the position and the situation of clustering of every failure type by observing Z-Score. Finally confirm the practicability of Z-Score through non-classified data set to get the achievement of increasing yield、testing efficiency and reduce the production cost.
    顯示於類別:[電機工程研究所] 博碩士論文

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