台灣製造業西進後並在對岸半導體技術提升的前提下，台灣製造業為了提升客戶滿意度以快速、精確、且成本低廉為首要目標。因此，為滿足各方的需求下任何企業皆需持續自我精進，在這樣的環境改變之下讓企業往往用節省整體生產營運成本與人力資源達到提升自我競爭力。故針對晶圓級封裝流程更進一步的研究與改善，將有助於台灣晶圓級封裝產業的市場環境中生存發展。 流程改善（Process optimization）是著重分析、設計企業內部工作流程，對於企業在不同領域與職掌上所做的不斷改進和完善，目前各個產業都廣泛的應用此方法提升自我的競爭力，期許企業可在各自的專業領域中佔有一席之地。 本研究乃藉由個案公司在晶圓封裝生產模式不斷改善的過程，以探討工作定義即應用精實技術與戴明循環的方法進行流程再造與流程改善以達到提高出貨量與降低人力成本，將其研究結果推展應用於其他晶圓級封裝產業，所得結論如下：(1) 流程再造後對於生產線流程改善。 (2) 工作問題解決達到持續改善。 ;After the advancement of Taiwan′s manufacturing industries moving to the mainland China in past years, they had created a target management to improve customer satisfaction with a speed, precisely and low-lost mode in their first priority. Therefore, in order to meet the needs of all parties, every company must continue to improve. Such an environmental change will make companies to reduce their overall operation cost and labor cost to enhance their own competitiveness. Therefore, the further research and improvement of the wafer-level packaging process will help Taiwan′s wafer-level packaging industry survive and develop in the severe environment. Process optimization emphasizes on the analysis and design of internal work processes, and on the continuous improvement of companies in different profession and aspect. Currently, all industries have applied this method to enhance their own competitiveness, and expect to success in their own expertise. This study was conducted in the process of continuous improvement of the wafer packaging production, use becoming lean and PDCA method to discuss the job definition and reorganization, and to increase shipments and reduce labor costs by processes improvement. To promote the research results to other wafer level packaging industry as below conclusions： (1) The improvement of the production line flow after reorganization of the work. (2) Continuous improvement by resolution of issues.
