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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/76986

    Title: 製備超親水聚合膜在聚碳酸酯表面研究;Characterization of Super-Hydrophilic Polymer Films on Polycarbonate Substrate
    Authors: 林育田;Lin, Yu-Tian
    Contributors: 光電科學與工程學系
    Keywords: 超親水;電漿聚合;持久性
    Date: 2018-08-21
    Issue Date: 2018-08-31 11:55:38 (UTC+8)
    Publisher: 國立中央大學
    Abstract: 近年來在親水塗層研究中,有一種表面具極端濕潤行為而被積極研究,即為超親水表面。當水滴滴附於超親水表面時,其水接觸角將小於10o,有助於使液體快速攤平,達到快速乾燥的優異性、除霧等特性。
    在持久性方面,射出型聚碳酸酯基板之超親水持久性可達34天,而押出型聚碳酸酯基板可達39天。;In recent years, there is a kind of extreme wetting behavior on the surface of hydrophilic coating, which is the super hydrophilic surface. When the water droplets are attached to a super-hydrophilic surface, the water contact angle will be less than 10 degrees. It is helpful to make the water droplets spread quickly and achieve the excellent properties of fast drying and mist removal.
    The aim of this study is to characterize the Super-Hydrophilic Polymer Films on Polycarbonate Substrate. First using oxygen and argon plasma to etch surface with roughness, and then using organic silane as the monomer for plasma polymerization .Finally hydrophilic free radicals deposited on the substrate. By adjusting the etching parameters, such as plasma current, voltage and deposition time, etc., making the surface extremely rough. The more rough the surface, the more hydrophilic functional on the surface, which can promote the persistence of super hydrophilic. In the preparation process, using optical emission spectrometer as a real-time monitoring of the plasma dissociation, so that the monomer has a higher probability of polymerize hydrophilic free radicals. The content of the constituent elements of the plasma polymerization film is analyzed by XPS, the hydrophilic functional has the most content, so the water contact angle is less than 10 degrees and achieves the super hydrophilic effect.
    In terms of durability, the super hydrophilic durability of the injection molded PC substrate can be up to 34 days. The compression molding PC substrate can be up to 39 days.
    Appears in Collections:[光電科學研究所] 博碩士論文

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