English  |  正體中文  |  简体中文  |  全文筆數/總筆數 : 80990/80990 (100%)
造訪人次 : 41636127      線上人數 : 1089
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
搜尋範圍 查詢小技巧:
  • 您可在西文檢索詞彙前後加上"雙引號",以獲取較精準的檢索結果
  • 若欲以作者姓名搜尋,建議至進階搜尋限定作者欄位,可獲得較完整資料
  • 進階搜尋


    請使用永久網址來引用或連結此文件: http://ir.lib.ncu.edu.tw/handle/987654321/81822


    題名: 以系統方法盤查擬定PCB廠溫室氣體減量措施之研究;Study on the method of system approach the greenhouse gas reduction measures of PCB factories
    作者: 高璿凱;Kao, Hsuan-Kai
    貢獻者: 環境工程研究所在職專班
    關鍵詞: 印刷電路板;溫室氣體盤查;減量措施;Printed circuit board process;Greenhouse gas inventory;Reduction measure
    日期: 2019-08-20
    上傳時間: 2019-09-03 17:04:55 (UTC+8)
    出版者: 國立中央大學
    摘要: 企業因政府及國際溫室氣體排放盤查減量之共識,許多企業已自主盤查了解自身溫室氣體排放情況,並進行排放減量之規劃與執行。國內企業主要依照環保署以ISO-14064-1為標準公告的溫室氣體盤查與登錄指引進行盤查,但其盤查沒有應用系統化的方式,將所有參與製程運作、組成與因子都考量進去,較無法具體擬定可執行之減量方法。故本研究先針對ISO-14064-1進行檢討,建立系統方法並考量生命週期評估進行印刷電路板廠盤查,並針對主要排放對象擬訂減量措施。本研究應用系統化的概念與原則,以系統化的方式對製造流程進行分析與界定。首先界定製造流程生產的產品,分析製造流程的組成與架構,進而分析出每個組成單元的輸入、輸出、運作程序與作用機制,逐步分析製造流程運作過程中,可能產生溫室氣體排放源,並導入生命週期評估分析,針對印刷電路板製造從原料的取得、製造、使用、回收、棄置等階段來進行製程溫室氣體排放源調查,並針對大量溫室氣體排放源,進行具體可執行的減量措施,研究結果顯示,本研究建立之系統方法盤查溫室氣體減量措施,可有效進行溫室氣體排放減量措施擬訂,證明本研究所建立的方法是正確的。
    ;Due to the consensus of the government and international greenhouse gas emission reductions, many companies have independently checked their own greenhouse gas emissions and planned and implemented emission reductions. Domestic enterprises mainly conduct inquiries in accordance with the guidelines for greenhouse gas inventory and registration announced by the Environmental Protection Agency based on ISO-14064-1,but there is no systematic approach to the investigation, and all the participating process operations, components and factors are considered. Defining an executable reduction method. Therefore, this study developed a system approach for ISO-14064-1 and considered a life cycle assessment for a printed circuit board factory inventory, and developed a reduction measure for major emission targets. This study applies systematic concepts and principles to analyze and define the manufacturing process in a systematic way. First, define the products produced by the manufacturing process, analyze the composition and structure of the manufacturing process, and then analyze the input, output, operating procedures and mechanism of each component, and gradually analyze the possible generation of greenhouse gas emission sources during the operation of the manufacturing process. Introduce life cycle assessment analysis, and conduct process greenhouse gas emission source survey for printed circuit board manufacturing from the acquisition, manufacture, use, recycling, and disposal of raw materials,and for a large number of greenhouse gas emission sources, specific implementation of the reduction measures, the research results show that the system method established in this study to check the proposed greenhouse gas reduction measures, can effectively reduce greenhouse gas emissions, prove that the method established in this study is correct of.
    顯示於類別:[環境工程研究所碩士在職專班] 博碩士論文

    文件中的檔案:

    檔案 描述 大小格式瀏覽次數
    index.html0KbHTML320檢視/開啟


    在NCUIR中所有的資料項目都受到原著作權保護.

    社群 sharing

    ::: Copyright National Central University. | 國立中央大學圖書館版權所有 | 收藏本站 | 設為首頁 | 最佳瀏覽畫面: 1024*768 | 建站日期:8-24-2009 :::
    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - 隱私權政策聲明