中大機構典藏-NCU Institutional Repository-提供博碩士論文、考古題、期刊論文、研究計畫等下載:Item 987654321/84205
English  |  正體中文  |  简体中文  |  Items with full text/Total items : 80990/80990 (100%)
Visitors : 41642480      Online Users : 1404
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version


    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/84205


    Title: 應用J類連續模式技術於Ka頻段砷化鎵與C頻段氮化鎵功率放大器之研製;Implementations on Ka-band GaAs and C-band GaN Power Amplifiers Using Class-J continuous mode Techniques
    Authors: 紀品瑜;Chi, Pin-Yu
    Contributors: 電機工程學系
    Keywords: J類功率放大器;連續模式技術;Class J power amplifier;continuous mode techniques
    Date: 2020-08-17
    Issue Date: 2020-09-02 18:29:15 (UTC+8)
    Publisher: 國立中央大學
    Abstract: 本論文利用穩懋半導體WINTM 0.15-µm GaAs與0.25-µm GaN製程設計三顆功率放大器。電路設計上選擇操作於C頻段與Ka頻段,首先模擬不同製程之電晶體特性,選擇最佳之電晶體尺寸與操作電流密度,結合J類諧波調節網路形成寬頻且高效率匹配,最後量測電路特性以驗證電路設計之結果。
    第一顆使用WINTM 0.15-µm GaAs製程於Ka頻帶之J類功率放大器,電路設計採全積體化之兩級共源極電路架構,輸出端利用緊湊的基頻、二倍頻匹配網路達到J類的設計,輸入端與級間匹配則以最大功率作最大輸出匹配。量測結果為3-dB頻寬為25.5-28.6 GHz,最大傳輸增益為16.63 dB,飽和輸出功率為27.36 dBm,1-dB 增益壓縮點輸出功率為26.46 dBm,晶片面積為1.12 (1.4 × 0.8) mm2。
    第二顆使用WINTM 0.15-µm GaAs製程於Ka頻帶之J類功率放大器,電路設計採全積體化之兩級共源極電路架構,輸出端利用超緊湊的基頻、二倍頻匹配網路達到高效率J類的設計,輸入端與級間匹配則以最大功率作最大輸出寬頻匹配,量測結果為3-dB頻寬為27.4-29.1 GHz,傳輸最大增益為16.84 dB,飽和輸出功率為28.15 dBm,1-dB 增益壓縮點輸出功率為27.04 dBm,晶片面積為0.988 (1.3 × 0.76) mm2。
    第三顆使用WINTM 0.25-µm GaN製程於C頻帶之J類功率放大器,電路設計採全積體化之兩級共源極電路架構,輸出端利用超緊湊的基頻、二倍頻匹配網路達到高效率J類的設計,輸入端與級間匹配則作寬頻匹配,為了應用在N77頻段,其操作頻寬為3 - 4.3 GHz,傳輸最大增益為23.94 dB,飽和輸出功率為39.62 dBm,1-dB 增益壓縮點輸出功率為39.6 dBm,晶片面積為4.342 (2.6 × 1.67) mm2。

    ;The thesis developed three power amplifiers that were designed in WINTM 0.15-µm GaAs, and 0.25-µm GaN for both C-band and Ka-band operations. Firstly, the transistor characteristics of different processes were simulated to choose the best transistor size and current density. The continuous class-J technique was adapted for high efficiency and broadband matching performance. Finally, these proof-of-concepts were verified by measuring various circuit performances, such as s-parameters, output power, linearity and digital modulation characteristics.
    The first chip presents a Ka-band monolithic microwave integrated circuit (MMIC) power amplifier in WINTM 0.25-µm GaAs technology. The high-efficiency performance is achieved by using continuous class-J mode for output matching networks and high power matching for both input and inter-stage matching networks. The designed power amplifier achieves a 3-dB bandwidth from 25.5 to 28.6 GHz with small signal gain of 16.63 dB. Continuous wave measurements demonstrate a maximum saturated output power of 27.36 dBm and OP1dB of 26.46 dBm, respectively. The chip size is 1.12 (1.4 × 0.8) mm2.
    The second chip presents a Ka-band MMIC power amplifier in WINTM 0.25-µm GaAs technology. The high-efficiency and broadband performances are achieved by using continuous Class-J mode for fundamental and second harmonic output matching networks and high power matching for both input and inter-stage matching networks. The amplifier achieves a 3-dB bandwidth from 27.4 to 29.1 GHz with small signal gain of 16.84 dB. Continuous wave measurements demonstrate a maximum saturated output power of 28.15 dBm and OP1dB of 27.04 dBm, respectively. The chip size is 0.988 (1.3 × 0.76) mm2.
    The third chip presents a C-band MMIC power amplifier in WINTM 0.25-µm GaN technology. The high-efficiency and broadband performances are achieved by using continuous Class-J mode for fundamental and second harmonic output matching networks and broadband matching for both input and inter-stage matching networks. The amplifier achieves a 3-dB bandwidth from 3 to 4.3 GHz with small signal gain of 23.94 dB. Continuous wave measurements demonstrate a maximum saturated output power of 39.62 dBm and OP1dB of 39.6 dBm, respectively. The chip size is 4.342 (2.6 × 1.67) mm2.
    Appears in Collections:[Graduate Institute of Electrical Engineering] Electronic Thesis & Dissertation

    Files in This Item:

    File Description SizeFormat
    index.html0KbHTML133View/Open


    All items in NCUIR are protected by copyright, with all rights reserved.

    社群 sharing

    ::: Copyright National Central University. | 國立中央大學圖書館版權所有 | 收藏本站 | 設為首頁 | 最佳瀏覽畫面: 1024*768 | 建站日期:8-24-2009 :::
    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - 隱私權政策聲明