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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/84333

    Title: 12英吋矽晶圓化學氣相沉積矽磊晶製程熱輻射加熱系統之數值分析;Numerical Analysis of Heat Radiation Heating System for 12-inch Silicon Wafer Chemical Vapor Deposition Silicon Epitaxial Process
    Authors: 李仁傑;Li, Jen-Chieh
    Contributors: 機械工程學系
    Keywords: 矽磊晶薄膜生長;熱輻射加熱;常壓化學氣相沉積;Silicon epitaxial film;Radiation heater;Atmospheric pressure chemical vapor deposition
    Date: 2020-07-29
    Issue Date: 2020-09-02 19:05:56 (UTC+8)
    Publisher: 國立中央大學
    Abstract: 常壓化學氣相沉積矽磊晶反應腔體內的溫度分布,對於磊晶製程非常重要,本研究針對反應腔體加熱系統進行改善分析。磊晶生長過程藉由上下兩組燈泡模組透過熱輻射將熱量傳遞至晶圓表面,這些模組包括燈絲加熱器、黃金反射罩、晶圓載盤、石英集熱環和冷卻系統等,本文藉由建立熱傳數值模型分析此磊晶反應腔體內傳熱過程,進而改善溫場分布來得到較佳的薄膜生長均勻性。
    ;It is known that temperature distribution in the silicon epitaxial process is meaningful to the atmospheric pressure chemical vapor deposition(APCVD) system. This study is to develop and optimize the silicon epitaxial heating system. The epitaxial growth process transfers heat to the wafer surface through thermal radiation by the lamp modules located in the chamber. The chamber consists of many different components, including filament heaters, golden reflectors, susceptor, quartz ring and cooling system, etc. This study analyzes the heat transfer process of the silicon epitaxial deposition chamber by establishing the numerical heat transfer model, and then improves the temperature field distribution to obtain better film growth uniformity.
    When the silicon epitaxial thin film is growing, the temperature field of the wafer on the substrate has a considerable influence on the epitaxial growth, and the temperature field is affected by the heat transfer mechanism in the chamber and the geometry of the chamber. In this study, the three-dimensional numerical model was first established, and then the temperature distribution of the epitaxial cavity and the wafer surface is obtained by numerical simulation. The input power is obtained by the real process temperature which is about 1050-1150°C. The distribution of the temperature field will affect the silicon epitaxial film growth profile, film deposition rate and flatness. The temperature field distribution is affected by the geometry and position of the golden reflectors, quartz ring, and the input power ratio of the upper and lower heaters. The above method is used to control the temperature of different area on the wafer surface in order to acquire a temperature field suitable for silicon epitaxial growth to improve film growth uniformity. This study will propose improved chamber structures in the heating system, such as golden reflectors and quartz ring.
    Appears in Collections:[機械工程研究所] 博碩士論文

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