關鍵字:晶片檢測、編碼理論、MATLAB、霍夫轉換、水痕;
Wafer product Quality is an important factor in semiconductor manufacturing.
Die defect inspection is an important quality control process before chip probing. Conventionally,the inspection of die surface defects by AOI,but AOI can′t catch water mark. Unexpected minor defects that are hard to inspect make quality control more difficult.
This research is to design and develop an automated visual inspection system for die surface defects by using the machine vision technology,coding theory, morphology,edge detection. The mainly focusedinspection items of dice are wafer mark,bump missing,bump damage and wafer scratch.
A prototype of the visual inspection system for water mark defect inspection will be implemented for inspection efficiency. We use 100 images to test the performance of this system. The results of water mark inspection experiment show that the accuracy is 100%,precision is 100%.
Keyword: Wafer Inspection、Coding Theory、MATLAB、Hough Transform、Water Mark
