分群座標化之良率及隨機均勻度檢定 在晶圓圖分析;Grouping the Yield and Randomness Homogeneity Tests in coordinate plane to Wafer Map Analysis

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Title:	分群座標化之良率及隨機均勻度檢定在晶圓圖分析;Grouping the Yield and Randomness Homogeneity Tests in coordinate plane to Wafer Map Analysis
Authors:	陳豪森;Chen, Hao-Sen
Contributors:	電機工程學系
Keywords:	晶圓測試;分群;隨機性判別;座標化;良率判別;wafer testing;clustering;randomness discrimination;coordinate;yield discrimination
Date:	2021-10-27
Issue Date:	2021-12-07 13:25:26 (UTC+8)
Publisher:	國立中央大學
Abstract:	測試晶圓需要耗損大量的時間及人力資源，在這個科技進步快速的時代中，不斷精進測試及找出錯誤晶圓的效率是必須的。而此篇論文的目的是藉由晶圓均勻度的檢定並分群找出良率或隨機性相似的晶圓，以達到快速分類別檢測的效果。之前已經有論文做晶圓良率與隨機性的均勻度分析，此篇論文將接下去做更為仔細的判別分類，先把良率均勻度分析與隨機性均勻度分析分別拉出來討論，各自相互比對，尋找相似的為同群集，不相似的則再分群出去，直到各族群間相互皆為同類群的晶圓為止。接著本篇論文還會繼續把良率與隨機性的相關數值(NBD及Bscore)做進一步的整合，以座標的方式找出在座標平面上的點後，找到群集中心後，經由各群集間的點到群集中心的距離作為判斷，找出各自的族群，再加以分析判別各族群的晶圓，以達到快速測試檢定的效果。 ;Testing needs to consume a lot of time and human resources. In this period of rapid technological progress, it is necessary to refine the testing and discover errors and constantly appearing results. The purpose of this paper is to produce throughput. And group into groups to find out the performance of yield or randomness, in order to achieve the effect of rapid classification detection. There have been papers on the uniformity analysis of wafer yield and randomness. This paper will do more careful discrimination and classification. First, the yield uniformity analysis and random uniformity analysis will be discussed separately. Compare with each other, look for similar ones as the same cluster, and then group out the dissimilar ones, until all ethnic groups are wafers of the same group. Then this paper will continue to further integrate the relevant values of yield and randomness (NBD and Bscore). After finding the point on the coordinate plane by means of coordinates, after finding the cluster center, go through the The distance from the point to the cluster center is used as a judgment to find out the respective ethnic groups, and then analyze the wafers of each ethnic group to achieve the effect of rapid test verification.
Appears in Collections:	[Graduate Institute of Electrical Engineering] Electronic Thesis & Dissertation

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